Layer sequence and method of manufacturing a layer sequence

Abstract

A layer sequence (400), comprising an aluminum layer (300), a nickel layer (301), and a nickel layer protection layer (302; 701). The aluminum layer (300) is formable on a substrate (200), the nickel layer (301) is formed on the aluminum layer (300), and the nickel layer protection layer (302; 701) is formed on the nickel layer (301).

Description

technical field [0001] The invention relates to layer sequences. [0002] The invention also relates to the use of layer sequences as under bump metallisation. [0003] The invention also relates to a method for producing a layer sequence. [0004] For the semiconductor industry, the manufacture of integrated circuits includes different stages, namely making the wafer, making the integrated circuit and connecting the integrated circuit to the environment, for example by soldering the integrated circuit to a PCB (printed circuit board). Background technique [0005] US2005 / 0012211A1 discloses an under bump metallurgy structure between die or substrate and solder bump bonding, comprising an adhesive layer, a barrier layer and a wettable layer. [0006] US 2005 / 0029677A1 discloses an under bump metallurgy (UBM) layer comprising a first metal layer, a liner layer, a second metal layer and a third metal layer. And, a passivation layer is formed on the surface of the chip. [...

AI Technical Summary

Problems solved by technology

[0007] However, the under bump metallization (UBM) according to US 2005 / 0029677 A1 is complex and thus time consuming and expensive to manufacture

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