Low threshold voltage electrostatic micro-relay

A low-threshold voltage, micro-relay technology, applied in electrostatic relays/electro-adhesion relays, relays, circuits, etc., can solve problems such as reducing driving voltage and compatibility, reducing contact resistance, simple manufacturing process, and increasing contacts. Effect of load current

Inactive Publication Date: 2008-06-11
HEFEI UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, since it is difficult to be compatible with the working voltage of ordinary electronic circuits, reducing the driv

Method used

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  • Low threshold voltage electrostatic micro-relay
  • Low threshold voltage electrostatic micro-relay
  • Low threshold voltage electrostatic micro-relay

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[0021] The present invention will be further described below in conjunction with the accompanying drawings.

[0022] The low-threshold voltage electrostatic micro-relay includes a pressure welding block 101, a movable comb 102 and a fixed comb 103, a contact 104, an isolation barrier 105, a folding spring beam 106, a multi-stage comb connection beam 107, an isolation wall 108, and a lining. Bottom 201, in which the pressure welding block 101 is used to apply electrical excitation; two or more movable comb teeth 102 are connected in parallel, and two or more fixed comb teeth 103 are connected in parallel. The number of movable comb teeth and fixed comb teeth are equal and arranged at intervals to form The cascaded comb tooth structure has more than two prongs 301 on the movable comb, and more than two prongs 302 on the fixed comb. The corresponding prongs 301 on the movable comb and the prongs on the fixed comb The teeth 302 are equal in number and arranged in a staggered form at i...

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Abstract

The invention relates to a low threshold voltage static micro relay, which comprises a movable comb and a fixed comb, a foldable spring beam and a multi-level comb connecting beam. A flat-plate capacitance is formed between the fork tines on the corresponding movable comb and the fork tines of the fixed comb. When the electric excitation is implemented, the movable comb drives the multi-level comb connecting beam to generate a transverse displacement, so that a contact contacts the fixed electrode in the circuit. When the electric excitation is removed, the elastic recovery force of the foldable spring beam allows the multi-level comb connecting beam to drive the contact to reset. The invention reduces the threshold voltage of micro relay by connecting comb level number in parallel manner and increasing number of the fork tines, thus solving the high driving voltage of the static micro relay and difficult compatibility with working circuit voltage in the prior art. The threshold voltage can be reduced to 5V, so that the driving voltage of the static micro relay can be compatible with the working voltage of common electronic circuit, thereby realizing reliable switch action under the working voltage of common electronic circuit.

Description

technical field [0001] The present invention relates to electrostatic microrelays used in microelectromechanical systems. Background technique [0002] As a basic electromechanical component, relays are widely used in various power protection, instrumentation and automatic control systems. In national defense, aerospace vehicles and various ground control equipment, relays of various specifications are also required. In this case, the requirements for them are reliable operation, large current when closed, small leakage current, and small contact resistance. It is required to be small in size, light in weight, fast in response, and long in life. [0003] The development of micro-relays is accompanied by the development of MEMS technology. Foreign countries began to research and manufacture micro-relays in 1978. Compared with traditional electromechanical relays, micromechanical relays have the advantages of small size, low power consumption, high capacity and integration. ...

Claims

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Application Information

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IPC IPC(8): H01H59/00
Inventor 许高斌何晓雄李洋
Owner HEFEI UNIV OF TECH
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