High efficiency and low cost thermoelectric module and making process thereof

Abstract

The invention relates to a thermoelectric component with high efficiency and low cost and the producing technique thereof, which comprises P-type and N-type semiconductor components, an upper baffle and a lower baffle, an upper electrical insulation and heat conducting layer and a lower electrical insulation and heat conducting layer and electrical and thermal insulation materials which are filled in the spare space; wherein, the upper and lower electrical insulation and heat conducting layer is the Al2O3 plating film which is plated on the baffle, and the upper baffle and the lower baffle adopt the block aluminum plate or the copper plate and are made through the etching technology. The invention has the advantages of greatly decreasing the consumption of the semiconductor material, adopting the aluminum plate to substitute the copper plate, lowering cost, simplifying making technology, being suitable for industrialized mass production, and greatly improving the refrigeration and induced thermal efficiency of the semiconductor thermoelectric component.

Description

Technical field [0001] The invention relates to the technical field of semiconductor physics, in particular to a high-efficiency and low-cost thermoelectric component using the principle of semiconductor thermoelectric cooling and a manufacturing process thereof. Background technique [0002] The principle of traditional semiconductor cooling chips comes from thermoelectric cooling, which is also called temperature difference cooling. The material with thermoelectric energy conversion characteristics has a cooling function when passing direct current, so it is called thermoelectric cooling. Because the semiconductor materials represented by Bi, Te, etc. have strong thermoelectric energy conversion characteristics, its application can truly make thermoelectric refrigeration practical, also known as semiconductor refrigeration. The origin of the name thermoelectric refrigeration is that people discover the opposite effect after discovering the thermoelectromotive force of the mater...

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to solve the problems of low cooling and heating efficiency of the original semiconductor cooling chip, high cost of raw materials and production, difficult manufacturing process, difficulty in realizing large-scale civil and commercial applications, etc., and provide a low-cost raw material High-efficiency and low-cost thermoelectric components with simple production process and production process

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