Packaging material composition

A technology for encapsulating materials and compositions, which can be applied in other chemical processes, chemical instruments and methods, etc., and can solve problems such as short-wavelength light transmittance drop, color shift, and application difficulties

Active Publication Date: 2008-07-02
IND TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the packaging materials for light-emitting devices must have homogeneity and high optical transmittance, and must pass long-term high-temperature storage and storage tests, the packaging materials for high-brightness LEDs must overcome the thermal yellowing caused by the high operating temperature derived from high current and other issues, and the epoxy resin currently used in LED packaging materials has a serious problem of thermal yellowing. In the long term thermal aging test (Long term thermal aging), the yellowing of the packaging material will cause a significant drop in short-wavelength light penetration , affect the light transmittance of the material and cause color shift, so the application of epoxy resin has great limitations in the environment of high power and high operating temperature
[0003] The anti-yellowing method of traditional transparent packaging materials such as epoxy resin is to add antioxidants, which function to remove peroxide radicals in the oxidation process to terminate the chain reaction, or decompose hydroperoxides in the oxidation process to slow down high Molecular cracking speed, but LEDs have long-term use requirements. It is found in experiments that antioxidants alone are not enough to solve the problem of high-temperature and long-term thermal yellowing resistance of LED packaging mat

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] Formula Table:

[0043] ingredients

Amount added (g)

Description / Remarks

EPON-828

100

Diepoxide functional resin / average epoxy equivalent weight: 190g / equivalent

[0044]

GT-1000

44.74

Refer to Epoxy Functional Aromatic Cyclosiloxane Resin / Average Epoxy Equivalent Weight

Quantity: 300-355g / equivalent

MHHPA

110.53

Anhydride hardener, molecular weight: 168g / mole

U-cat 5003

0.72

Quaternary Phosphonium Bromide Accelerator

[0045] Wherein the epoxy resin of non-siloxane is bisphenol A diglycidyl ether (Diglycidyl ether of Bisphenol A) (EPON-828, purchased from Shell chemical company), and the siloxane epoxy resin is (phenylmethylsiloxane -co-dimethylsiloxane)-triglycidyl ether terminated resin (Phenylmethylsiloxnae-co-dimethylsiloxne)-triglycidyl ether terminated) (GT-1000, purchased from Guangke Chemical Company), the anhydride hardener is methylhexa...

Embodiment 2

[0049] Formula Table:

[0050] ingredients

Amount added (g)

Description / Remarks

EPON-828

100

Diepoxide functional resin / average epoxy equivalent weight: 190g / equivalent

GT-1000

179.94

Refer to Epoxy Functional Aromatic Cyclosiloxane Resin / Average Epoxy Equivalent Weight:

300-355g / equivalent

MHHPA

176.8

Anhydride hardener, molecular weight: 168g / mole

U-cat 5003

1.4

Quaternary Phosphonium Bromide Accelerator

Chitex 127

0.11

Fluorescent whitening agent

[0051] The preparation method of the encapsulation material of embodiment 2 is the same as embodiment 1, and its difference is to add fluorescent whitening agent Chitex 127 (purchased from Double bond chemical company) in its formula, molecular structural formula is as follows:

[0052] Chitex 127

[0053] It is placed in a reactor together with the catalyst and the hardener, and after stirring fo...

Embodiment 3

[0056] Formula Table:

[0057] ingredients

Amount added (g)

Description / Remarks

4221EL

100

Diepoxide functional resin / average epoxy equivalent weight: 137g / equivalent

GT-1250

257.35

Refer to Epoxy Functional Aromatic Cyclosiloxane Resin / Average Epoxy Equivalent Weight:

1150-1650g / equivalent

MHHPA

154.4

Anhydride hardener, molecular weight: 168g / mole

U-cat 5003

1.84

Quaternary Phosphonium Bromide Accelerator

Chitex 127

0.13

Fluorescent whitening agent

[0058] The manufacturing method of the encapsulation material of embodiment 3 is the same as embodiment 2, and its difference is that the epoxy resin of non-siloxane used in its formula is cycloaliphatic epoxy resin (Cycloaliphatic epoxy) (4221EL, purchased from Dow chemical. company), and the siloxane epoxy resin it uses is also different from Example 2, which is GT-1250 (purchased from Guangke Che...

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Abstract

The invention provides a packaging material composition, which comprises (a) 20 to 60wt% non-siloxane epoxy resin; (b) 5 to 50wt% siloxane epoxy resin containing aromatic siloxane 1 to 45wt%; and (c) 27 to 45wt% anhydride hardener. Additionally, the invention also provides another packaging material composition, which contains (a) 30 to 50wt% non-siloxane epoxy resin; (b) 5 to 50wt% alicyclic siloxane anhydride hardener; and (c) 27 to 45wt% anhydride hardener. The packaging material composition of the invention can be used for the transparent package material of a solid light emitting device, achieving the effect of long-time resistance to yellowing at high temperature.

Description

technical field [0001] The invention relates to an encapsulation material composition, in particular to an anti-thermal yellowing encapsulation material composition, which can be used as a transparent encapsulation material for solid-state light-emitting devices. Background technique [0002] In recent years, light emitting diodes (LEDs for short) have been gradually used in display backlights, vehicle light sources, large display panels and general lighting sources, and the demand for high-brightness LEDs is increasing day by day. Since the packaging materials for light-emitting devices must have homogeneity and high optical transmittance, and must pass long-term high-temperature storage and storage tests, the packaging materials for high-brightness LEDs must overcome the thermal yellowing caused by the high operating temperature derived from high current and other issues, and the epoxy resin currently used in LED packaging materials has a serious problem of thermal yellowi...

Claims

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Application Information

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IPC IPC(8): C09K3/10C08L63/00C08K5/5415C08K5/524C08K5/353
Inventor 许嘉纹陈凯琪李巡天
Owner IND TECH RES INST
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