Sensing type packaging part and manufacturing method thereof

Abstract

The invention discloses a sensitive packaging part and a manufacturing method thereof. The invention provides a baseplate pattern assembly sheet with a plurality of baseplates which are arranged in array. A plurality of via holes of electric property are arranged between adjacent baseplates, which are filled with and covered with conducting materials. Dam structures covering the conducting materials are formed between adjacent baseplates on the baseplate pattern assembly sheet. The via holes are filled and covered with such conducting materials as soldering tin to prevent the material constituting the dam structure from being drained onto the other surface of the baseplates through via holes. In addition, a tape is not required to be covered on the via holes in advance. The invention eliminates the problem that the tape absorbs moisture which results in separation of the dam structures and the baseplates. Subsequently, sensitive chips can be electrically connected in areas enclosed by the dam structures on the baseplates; transparent units covering the sensitive chips are connected to the dam structures. In the subsequent cutting process, a plurality of sensitive packaging parts are got by means of cutting between the baseplates.

Description

technical field [0001] The invention relates to a semiconductor package and its manufacturing method, in particular to a sensing package and its manufacturing method. Background technique [0002] The traditional image sensor package mainly connects the sensor chip (Sensor chip) on a chip carrier, and electrically connects the sensor chip and the chip carrier through bonding wires, and then A glass is sealed above the sensing chip, so that the image light can be picked up by the sensing chip. In this way, the completed image sensing package can be used by the system factory to integrate on external devices such as printed circuit boards (PCBs) for digital cameras (DSC), digital video cameras (DV), optical mice, etc. , mobile phones and other electronic products. Related technologies can be disclosed in US Patent Nos. 6,262,479, 6,590,269 and 5,962,810. [0003] see figure 1 , to show the sensing package disclosed in US Pat. No. 6,262,479, which forms a dam structure 13 o...

AI Technical Summary

Problems solved by technology

[0006] However, because the film is easy to absorb moisture, it will cause delamination between the dam structure and the substrate, and the use of the film will also increase the cost and steps of the process; moreover, the process of the aforementioned sensing package is mainly in one Substrate modules with multiple substrates arranged in an array are produced in batches, and a plurality of electrical via holes are provided between adjacent substrates. Therefore, after covering the electrical via holes with film, After encapsulation and molding to form the dam structure, as well as placing the crystal and covering the glass, the singulation operation can be performed, and when the cutting tool cuts the film along the adjacent substrate, it is easy to take out the film material together. Cause film residue problem

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