High power LED ceramic packaging base

Abstract

The present invention relates to a ceramic packaging base, in particular to an SMD high power LED ceramic packaging base. The present invention consists of an upper ceramic layer and a lower ceramic layer, wherein the upper ceramic layer provides a reflection cup; the upper ceramic layer is made of LECC glass ceramic material; the upper side of the lower ceramic layer is provided with a wire bonding area and a bottom bonding pad; the base is also provided with an electric conducting through hole; the lower ceramic layer is made of high thermal conductivity alumina ceramic material or aluminum nitride ceramic material, and is used to raise the entire mechanical strength and heat dissipation performance of the packaging base. The ceramic packaging base has the advantages of raising the heat dissipation performance of the SMD high power LED ceramic packaging base, improving the problem that temperature rise causes high light decay and life-span decrease of an LED chip, strengthening the performance of LED products in resisting high / low temperature and impact, raising the reliability as well as stability of products and reducing production cost.

Description

technical field [0001] The invention relates to a ceramic package base, in particular to an SMD high-power LED ceramic package base. Background technique [0002] As a new type of light source, LED has achieved unprecedented development due to its incomparable advantages such as energy saving, environmental protection, long life, fast start-up speed, controllable luminous spectrum and forbidden band size to make the chroma higher than traditional light sources. With the increase of LED current intensity and light emission, the calorific value of LED chips also increases. For high-power LEDs, 80% of the input energy is consumed in the form of heat. If the heat cannot be discharged to the outside in time, it will cause the temperature rise effect of the chip, and the lifespan and light output of the LED will be greatly reduced; the thermal conductivity of the traditional epoxy resin package base is only 0.47W / mK, which is far from meeting the needs of high-power LEDs. LED the...

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Problems solved by technology

[0005] The disadvantages and causes of the above structure include: 1) The thermal conductivity of the epoxy resin package base and the aluminum substrate is low, and the thermal expansion coefficient is too different from that of the high-power LED chip, which leads to greatly reduced luminous efficiency and life, and fails to achieve high Technical requirements for power and long life

2), the existing LTCC ceramic package base mainly has two disadvantages: the first point is that both layers use LTCC ceramic materials, so the mechanical strength is relatively poor; the second point is that due to the low thermal conductivity of the bottom ceramic LTCC material, The lateral heat dissipation performance of the base is poor, so the overall heat dissipation performance of the package base is greatly weakened, and the life and luminous efficiency of high-power LEDs are affected

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