Thermosetting solvent-free single-component substances and use thereof

A heat-curable, composition-based technology, applied in the direction of adhesives, adhesive types, polyurea/polyurethane adhesives, etc., can solve problems such as slow curing speed, and achieve low curing temperature and time required for the bonding process. , beneficial effect on energy consumption

Active Publication Date: 2008-08-27
DELO工业胶粘剂有限及两合公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these times are much too long for speed-critical applications
[0012] Thus, the disadvantages of existing isocyanate compositions can be summarized as fol

Method used

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  • Thermosetting solvent-free single-component substances and use thereof
  • Thermosetting solvent-free single-component substances and use thereof
  • Thermosetting solvent-free single-component substances and use thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0050] Example 1 (comparative example)

[0051] The prior art composition consisting of epoxy resin and latent curing agent is intended to be regarded as a comparative example. It consists of the following:

[0052] 67% mixture of bisphenol A- and bisphenol F-epoxy resin (EPR166 from Bakelite),

[0053] 27% latent amine curing agent (Ancamine 2014AS from Air Products),

[0054] 3.5% accelerator (Dicyandiamide Dyhard SF 100 from Degussa),

[0055] 2.5% thixotropic agent (Cab-O-Sil M5 from Cabot).

[0056] The following properties of the examples were measured:

[0057] 1. Curing peak

[0058] The reaction peak of the comparative composition was measured on a DSC 822 DSC instrument (DSC = Differential Scanning Calorimetry, Differential Thermal Analysis) from Mettler-Toledo Company, as figure 1 As can be seen from the DSC curve shown, the peak is located at about 125°C.

[0059] 2. Curing speed

[0060] The curing speed in vibration mode at a constant temperature was measured on a r...

Example Embodiment

[0063] Example 2

[0064] The composition of the present invention consists of the following ingredients:

[0065] 73.5% MDI-based polyisocyanate (Desmodur VL R20, Bayer),

[0066] 24.5% latent amine curing agent (Ancamine 2014AS, Air Products),

[0067] 1.5% thixotropic agent (Cab-O-Sil M5, Cabot),

[0068] 0.5% adhesion promoter (Dynasilan Glymo, Degussa).

[0069] The DSC curve of the composition ( figure 2 ) Shows the reaction peak temperature at 74°C, which is about 50°C lower than in the comparative example. The lower reaction temperature makes it obvious that a significantly higher reaction rate than the comparative example can be observed. by image 3 The rheometer curve of the comparative example (the curve on the right) yields a curing time of about 60 seconds at 150°C, while for the composition of the present invention ( image 3 Center left curve) curing time is only 10 seconds. The composition of the present invention requires about 60 seconds to cure at 120°C and 8 mi...

Example Embodiment

[0070] Example 3

[0071] The composition of the present invention consists of the following ingredients:

[0072] 65% IPDI-based polyisocyanate (Desmodur VP LS 2371, Bayer),

[0073] 33% latent amine curing agent (Adeka Hardener EH4337, Asahi Denka),

[0074] 1.5% thixotropic agent (Cab-O-Sil M5, Cabot),

[0075] 0.5% adhesion promoter (Dynasilan Glymo, Degussa).

[0076] Table 1 lists the most important properties of the composition.

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Abstract

Disclosed is a thermosetting, solvent-free single-component substance that has a minimum shelf life of 2 weeks at ambient temperature and is composed of (A) 5 to 90 parts by weight of an at least bifunctional (iso)cyanate component, (B) 5 to 50 parts by weight of a latent hardener which is solid up to a temperature of at least 40 DEG C and is based on nitrogen compounds suitable for addition-crosslinking, (C) 0 to 50 parts by weight of an epoxy-containing compound, D) 0 to 50 parts by weight of modifiers, the sum of all parts by weight amounting to 100. Also disclosed is the use of said substance for gluing, pouring, sealing, and coating substrates, particularly of electronic components. The inventive substance is cured within seconds at 120 to 150 DEG C.

Description

technical field [0001] The present invention relates to heat-curing, solvent-free one-component compositions based on (iso)cyanates and latent hardeners, and to their use for bonding, casting, sealing and coating substrates. The compositions are widely used and as bonding and sealing compositions for construction purposes, as structural adhesives or in the electronics industry as casting and coating compositions. Background technique [0002] Hereinafter, the term "(iso)cyanate" refers to the group consisting of cyanate, isocyanate and mixtures of cyanate and isocyanate. The way the class is written. [0003] In relation to the present invention, the term "latent curing agent" means a curing agent which is solid under storage conditions up to a temperature of at least 40° C. and remains inactive for a certain period of time, but which is The curative becomes active in the molten liquid state at a temperature of 80-160°C, and causes polyaddition and crosslinking reactions b...

Claims

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Application Information

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IPC IPC(8): C09J175/02
CPCC09J175/02
Inventor M·斯达姆贝克J·科布勒
Owner DELO工业胶粘剂有限及两合公司
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