A kind of dual curing front-line polymerized conductive silver glue and preparation method thereof

A front-line polymerization, conductive silver adhesive technology, applied in the field of conductive adhesive, can solve the problems of inability to perform thermal curing, the adhesive layer is easy to fall off, and the hardness of the adhesive layer is low, and achieves the effect of improving hardness, short curing time and excellent performance

Active Publication Date: 2017-08-01
佛山市顺德区百锐新电子材料有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Since the conductive silver adhesive has a large amount of silver powder filler, when the adhesive layer has a certain thickness, the bottom of the adhesive layer cannot absorb ultraviolet rays when it is cured by a UV lamp. The main reason is that the resin in its raw material is made of acrylate. Under the UV light, the photoinitiator decomposes to produce free radicals to initiate the carbon-carbon double bond cross-linking and curing in the acrylate. It cannot be cured by heat, but can only be cured by UV light. The reaction effect causes the hardness of the adhesive layer to be low and sticky. Small binding force makes the glue layer fall off easily

Method used

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Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment

[0034] (1) Preparation of semi-finished base material:

[0035] Bisphenol A epoxy resin 3.5 parts

[0036] Cycloaliphatic epoxy resin 15

[0037] Photoinitiator 2 parts

[0038] Thermal initiator 2 parts

[0039] Antioxidant 0.5

[0040] UV absorber 0.5

[0041] 1 part coupling agent

[0042] Dispersant 0.5

[0043] Stir and disperse the above-mentioned materials evenly and then grind them three times with a three-roller machine to obtain a semi-finished base material;

[0044] (2) Preparation of conductive silver glue:

[0045] Semi-finished base material 25 parts

[0046] Flake silver powder 75 parts

[0047] Stir and disperse the above materials evenly, then grind them with a three-roller machine until the fineness is below 15um, and use a silver glue degassing machine to degas them for 5 to 10 minutes to obtain a double-cured front-line polymerized conductive silver glue.

no. 2 Embodiment

[0049] (1) Preparation of semi-finished base material:

[0050] Hydrogenated bisphenol A epoxy resin 9 parts

[0051] Alicyclic epoxy resin 9.5 parts

[0052] Photoinitiator 2 parts

[0053] Thermal initiator 2 parts

[0054] Antioxidant 0.5 part

[0055] UV absorber 0.5 parts

[0056] 1 part coupling agent

[0057] Dispersant 0.5 parts

[0058] Stir and disperse the above-mentioned materials evenly and then grind them three times with a three-roller machine to obtain a semi-finished base material;

[0059] (2) Preparation of conductive silver glue:

[0060] Semi-finished base material 25 parts

[0061] Flake silver powder 75 parts

[0062] Stir and disperse the above materials evenly, then grind them with a three-roller machine until the fineness is below 15um, and use a silver glue degassing machine to degas them for 5 to 10 minutes to obtain a double-cured front-line polymerized conductive silver glue.

[0063] In this embodiment, hydrogenated bisphenol A can be a...

no. 3 Embodiment

[0065] (1) Preparation of semi-finished base material:

[0066] Novolak epoxy resin 5 parts

[0067] Alicyclic epoxy resin 18.5 parts

[0068] Photoinitiator 2 parts

[0069] Thermal initiator 2 parts

[0070] Antioxidant 0.5

[0071] UV absorber 0.5

[0072] 1 part coupling agent

[0073] Dispersant 0.5

[0074] Stir and disperse the above-mentioned materials evenly and then grind them three times with a three-roller machine to obtain a semi-finished base material;

[0075](2) Preparation of conductive silver glue:

[0076] Semi-finished base material 30 parts

[0077] Flake silver powder 70 parts

[0078] Stir and disperse the above materials evenly, then grind them with a three-roll machine until the fineness is below 15um, and use a silver glue degassing machine to degas the silver for 5 to 10 minutes to obtain a double-cured front-line polymerized conductive silver glue.

[0079] In this embodiment, novolac epoxy resin is added to improve the hardness and heat r...

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Abstract

The invention discloses a dual-curing front-line polymerization conductive silver glue and a preparation method thereof, which can be cured by light and heat, and the conductive silver glue can reach deep curing by using the principle of front-line polymerization. It is made by mixing, stirring, grinding and dispersing epoxy resin, epoxy reactive diluent, photoinitiator, latent thermal initiator, antioxidant, ultraviolet absorber, coupling agent, dispersant and conductive particles. After photoinitiation, the conductive adhesive uses front-line polymerization to achieve deep thermal initiation to achieve complete curing. It can achieve thick curing of the adhesive layer. After curing, it has good adhesion, solvent resistance, and low resistivity. It can meet the requirements of LED chips, liquid crystal materials, The technical needs of microelectronic packaging such as thin film resistors and PCB boards.

Description

technical field [0001] The invention relates to a conductive adhesive, in particular to a conductive silver adhesive which utilizes the principle of front-line polymerization to achieve deep curing by light curing and thermal curing. Background technique [0002] At present, conductive silver glue is an electronic chemical made by filling conductive silver powder that provides electrical properties into a polymer binder that provides mechanical properties. It is an adhesive that can effectively bond various materials and has conductive properties. adhesive. [0003] Since the conductive silver adhesive has a large amount of silver powder filler, when the adhesive layer has a certain thickness, the bottom of the adhesive layer cannot absorb ultraviolet rays when it is cured by a UV lamp. The main reason is that the resin in its raw material is made of acrylate. Under the UV light, the photoinitiator decomposes to produce free radicals to initiate the carbon-carbon double bon...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/02C09J163/04C09J11/04C09J11/06C09J9/02
Inventor 何伟雄敖玉银
Owner 佛山市顺德区百锐新电子材料有限公司
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