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Double-curing frontal polymerization conductive silver adhesive and preparing method thereof

A front-line polymerization, conductive silver adhesive technology, applied in the field of conductive adhesive, can solve the problems of inability to perform thermal curing, the adhesive layer is easy to fall off, and the hardness of the adhesive layer is low, and achieves the effect of improving hardness, short curing time and excellent performance

Active Publication Date: 2015-11-18
佛山市顺德区百锐新电子材料有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Since the conductive silver adhesive has a large amount of silver powder filler, when the adhesive layer has a certain thickness, the bottom of the adhesive layer cannot absorb ultraviolet rays when it is cured by a UV lamp. The main reason is that the resin in its raw material is made of acrylate. Under the UV light, the photoinitiator decomposes to produce free radicals to initiate the carbon-carbon double bond cross-linking and curing in the acrylate. It cannot be cured by heat, but can only be cured by UV light. The reaction effect causes the hardness of the adhesive layer to be low and sticky. Small binding force makes the glue layer fall off easily

Method used

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Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment

[0034] (1) Preparation of semi-finished base material:

[0035] Bisphenol A epoxy resin 3.5 parts

[0036] Cycloaliphatic epoxy resin 15

[0037] 2 parts photoinitiator

[0038] 2 parts thermal initiator

[0039] Antioxidant 0.5

[0040] UV absorber 0.5

[0041] 1 part coupling agent

[0042] Dispersant 0.5

[0043] Stir and disperse the above-mentioned materials evenly and then grind them three times with a three-roller machine to obtain a semi-finished base material;

[0044] (2) Preparation of conductive silver glue:

[0045] 25 parts semi-finished base material

[0046] 75 parts of flake silver powder

[0047] Stir and disperse the above materials evenly, then grind them with a three-roller machine until the fineness is below 15um, and use a silver glue degassing machine to degas them for 5 to 10 minutes to obtain a double-cured front-line polymerized conductive silver glue.

no. 2 Embodiment

[0049] (1) Preparation of semi-finished base material:

[0050] 9 parts hydrogenated bisphenol A epoxy resin

[0051] Alicyclic epoxy resin 9.5 parts

[0052] 2 parts photoinitiator

[0053] 2 parts thermal initiator

[0054] Antioxidant 0.5 parts

[0055] 0.5 parts of ultraviolet absorber

[0056] 1 part coupling agent

[0057] Dispersant 0.5 parts

[0058] Stir and disperse the above-mentioned materials evenly and then grind them three times with a three-roller machine to obtain a semi-finished base material;

[0059] (2) Preparation of conductive silver glue:

[0060] 25 parts semi-finished base material

[0061] 75 parts of flake silver powder

[0062] Stir and disperse the above materials evenly, then grind them with a three-roller machine until the fineness is below 15um, and use a silver glue degassing machine to degas them for 5 to 10 minutes to obtain a double-cured front-line polymerized conductive silver glue.

[0063] In this example, hydrogenated bisphen...

no. 3 Embodiment

[0065] (1) Preparation of semi-finished base material:

[0066] Novolak epoxy resin 5 parts

[0067] Alicyclic epoxy resin 18.5 parts

[0068] 2 parts photoinitiator

[0069] 2 parts thermal initiator

[0070] Antioxidant 0.5

[0071] UV absorber 0.5

[0072] 1 part coupling agent

[0073] Dispersant 0.5

[0074] Stir and disperse the above-mentioned materials evenly and then grind them three times with a three-roller machine to obtain a semi-finished base material;

[0075] (2) Preparation of conductive silver glue:

[0076] 30 parts of semi-finished base material

[0077] 70 parts of flake silver powder

[0078] Stir and disperse the above materials evenly, then grind them with a three-roller machine until the fineness is below 15um, and use a silver glue degassing machine to degas them for 5 to 10 minutes to obtain a double-cured front-line polymerized conductive silver glue.

[0079] In this embodiment, novolac epoxy resin is added to improve the hardness and heat ...

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Abstract

The invention discloses double-curing frontal polymerization conductive silver adhesive and a preparing method thereof. Photocuring and thermocuring can be carried out, the frontal polymerization theory is utilized, and the conductive silver adhesive can achieve deep layer curing. The conductive silver adhesive is prepared by mixing, stirring, grinding and dispersing epoxy resin, epoxy reactive diluent, a photoinitiator, a latent thermal initiator, an antioxidant, an ultraviolet light absorber, a coupling agent, a dispersing agent and conducting particles. After photo-initiation is carried out on the conductive silver adhesive, frontal polymerization is used for achieving deep layer thermal initiation so as to achieve complete curing, thick curing of an adhesive layer can be achieved, the good adhesive property and solvent resistance are achieved after curing, the specific resistance is low, and the technical needs for microelectronic packaging of LED chips, liquid crystal materials, thin-film resistors, PCBs and the like can be met.

Description

technical field [0001] The invention relates to a conductive adhesive, in particular to a conductive silver adhesive which utilizes the principle of front-line polymerization to achieve deep curing by light curing and thermal curing. Background technique [0002] At present, conductive silver glue is an electronic chemical made by filling conductive silver powder that provides electrical properties into a polymer binder that provides mechanical properties. It is an adhesive that can effectively bond various materials and has conductive properties. adhesive. [0003] Since the conductive silver adhesive has a large amount of silver powder filler, when the adhesive layer has a certain thickness, the bottom of the adhesive layer cannot absorb ultraviolet rays when it is cured by a UV lamp. The main reason is that the resin in its raw material is made of acrylate. Under the UV light, the photoinitiator decomposes to produce free radicals to initiate the carbon-carbon double bon...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/02C09J163/04C09J11/04C09J11/06C09J9/02
Inventor 何伟雄敖玉银
Owner 佛山市顺德区百锐新电子材料有限公司
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