Film-forming composition, method for pattern formation, and three-dimensional mold
A three-dimensional model, composition technology, applied in chemical instruments and methods, nanotechnology for information processing, photosensitive materials for optomechanical devices, etc.
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no. 1 approach
[0070]
[0071] figure 1 A process diagram showing a pattern forming method using a photolithography technique which is the first embodiment of the present invention. In the first embodiment, including: coating process ( figure 1 (a)), the first baking process (not shown), exposure process ( figure 1 (b)), the second firing process (not shown) and the development process ( figure 1 (c1) and figure 1 (c2)). Each step will be described below.
[0072] [Coating process]
[0073] figure 1 (a) is a figure which shows the coating process of the pattern forming method of 1st Embodiment of this invention. The coating step refers to a step of coating the film-forming composition 2 of the present invention on the substrate 1 to obtain a coating layer of the film-forming composition 2 . The coating method may be a spray method, a roll coating method, a spin coating method, or the like.
[0074] The substrate material used in the present invention is not particularly limited. ...
no. 2 approach
[0090]
[0091] figure 2 Process diagrams showing a second embodiment of the present invention, that is, a method of forming a pattern having stepped unevenness. In the second embodiment, as in the first embodiment, a coating step (not shown), a first firing step (not shown), an exposure step ( figure 2 (a)~(d)), the second firing step (not shown) and the developing step ( figure 2 (e)).
[0092] The coating step, first firing step, and second firing step in the second embodiment can be performed in the same manner as in the first embodiment. The exposure process in the second embodiment ( figure 2 (a)~(d)) and developing process ( figure 2 (e)) for clarification.
[0093] [Exposure process]
[0094] The exposure process in the second embodiment includes the first exposure process ( figure 2 (a)~(b)) and the second exposure process ( figure 2 (c)~(d)). The first exposure step and the second exposure step are steps of performing exposures with different irradi...
Embodiment 1
[0159] 367.7 g (2.7 mol) of methyltrimethoxysilane, 411.0 g (2.7 mol) of tetramethoxysilane, 690.5 g of acetone, and 690.5 g of isopropanol were mixed and stirred. 340.2 g (19.0 mol) of water and 58.9 µL of 60% by mass nitric acid were added thereto, and further stirred for 3 hours to perform a hydrolysis reaction. The hydrolysis rate at this time was about 200%.
[0160] Next, it was made to react at 26 degreeC for 2 days, and the reaction solution containing a siloxane polymer was obtained. The weight average molecular weight (Mw) of the siloxane polymer in a reaction solution was 1956.
[0161] Using a mixed solution of acetone:isopropanol=1:1, the resulting reaction solution was prepared so that the mass percentage in terms of Si would be 7% by mass. Further, 51.4 g (0.189 mol) of a photobase generator (trade name: NBC-101, manufactured by Midori Kagaku) represented by the following formula (B) was added to the prepared solution as a contrast enhancer to obtain a film-...
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