X-ray examination method and X-ray examination apparatus

Abstract

The invention provides an X-ray examination apparatus for processing high-speed examination to object in specified examination region. The X-ray examination apparatus includes a scanning X-ray source for outputting X-rays, a sensor base which is attached with a plurality of X-ray sensors and which rotates about a rotation axis, and an image acquiring control mechanism for controlling rotation angle of the sensor base and acquisition of image data from the X-ray sensors. With respect to each X-ray sensor, the scanning X-ray source moves the X-ray focal position of the X-ray source to each starting position of the X-ray emission set so that the X-ray transmits through a predetermined examination area of an examination target and enters each X-ray sensor, and emits the X-rays. The image control acquiring control mechanism acquires image data detected by the X-ray sensors, and a calculation unit reconstructs an image of the examination area based on the image data.

Description

technical field [0001] The invention relates to an X-ray inspection method and an X-ray inspection device. In particular, it relates to an imaging method for inspecting an object by X-ray irradiation, and this technology can be applied to an X-ray inspection method and a technology of an X-ray inspection apparatus. Background technique [0002] In recent years, LSI (Large-Scale Integration: Large-Scale Integration) has become more integrated with the help of submicron-level microfabrication technology, so it is possible to integrate functions that were previously divided into multiple packages into one LSI. In conventional QFP (Quad Flat Package: Quad Flat Package) or PGA (Pin Grid Array: Pin Grid Array Package), it was impossible to solve the problem of increasing the number of pins when incorporating required functions into one package. Therefore, LSIs in BGA (Ball Grid Array: ball grid array package) or CSP (Chip Size Package: chip size) package are particularly used rec...

AI Technical Summary

Problems solved by technology

In this case, if the parts to be inspected to be inspected are arranged in a dispersed state, from the standpoint of increasing the size of the device and increasing the calculation load, etc., it is necessary to prepare an area (or volume) including the entire area (or volume) as the inspection object. Radiation detection equipment is an inefficient thing

[0013] In addition, to change the inspection area, it is necessary to move the imaging system or the workpiece to be inspected, so the number of moving parts increases.

Therefore, there will be problems in cost, maintainability and reliability

[0014] Or, when changing the inspection area when the area to be inspected is large (for example, a glass substrate), it may be difficult to move the workpiece side in the X-Y direction or rotate it 360 degrees

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