Thermal treatment method for reducing encapsulation angularity

Abstract

The invention provides a heat disposal method, comprising the steps that: a wire frame typed semiconductor encapsulating semi-finished product is provided and a heating method is guided in. the wire frame typed semiconductor encapsulating semi-finished product comprises a wire frame and a sealed colloid. The wire frame comprises a plurality of encapsulating units which are wrapped by the sealed colloid. In the heating method, the built-in temperature and the peak temperature are provided. The temperature of the wire frame semiconductor encapsulating semi-finished product achieves the peak temperature from the built-in temperature after thermal reaction time; furthermore, the deformation quantity of the wire frame typed semiconductor encapsulating semi-finished product is reduced or the stress between the wire frame and the sealed colloid is released to reduce a warping degree; wherein, the peak temperature is set within 190-260 DEG C.

Description

technical field [0001] The present invention relates to a packaging method, and in particular to a heat treatment method for reducing package warpage. Background technique [0002] A conventional semiconductor package structure packaged with a lead frame has a plurality of external leads extending from the side of the encapsulant, and these external leads can be used for external electrical connection. In the leadless semiconductor package structure, the lower surfaces of the leads of the lead frame are exposed on the surface of the encapsulant as external connection terminals. Therefore, the leadless semiconductor package structure has a smaller footprint and size as well as a shorter electrical transmission path, so it meets the low-cost packaging requirements of high-frequency and small-sized integrated circuits. [0003] In the known leadless semiconductor package structure, the encapsulant is first formed on each package unit of the lead frame and the dicing lines arou...

AI Technical Summary

Problems solved by technology

However, due to the large difference in the thermal expansion coefficients of the encapsulant and the lead frame, the coefficient of thermal expansion does not match (CTE mismatch). Therefore, after the post-baking and curing steps, thermal stress will be generated between the encapsulant and the lead frame, making the cured Severe deformation and warpage of the encapsulant resulted in a reduction in the pass rate of the method and difficulties in subsequent packaging steps, such as the steps of electroplating the external terminals, electrical testing, and sawing the encapsulant, etc.

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