Heat-resistant strippable micro-viscous pressure-sensitive adhesive film and preparation thereof

A sensitive adhesive film, micro-adhesive technology, applied in the field of heat-resistant peelable micro-adhesive pressure-sensitive adhesive film and its preparation, can solve the problem of inability to achieve direct peeling, etc., and achieve the effect of convenient operation

Inactive Publication Date: 2008-10-01
SHENZHEN DANBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Chinese patent ZL200410022029.6, the patent name "UV curable peelable pressure-sensitive adhesive film and its preparation method" discloses UV curable pressure-sensitive adhesive film used in the field of electronics industry, but its peeling needs to be irradiated by UV, and direct peeling cannot be achieved
In addition, there are almost no reports on heat-resistant peelable micro-adhesive pressure-sensitive adhesive films and their manufacturing methods fo

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] In a three-neck flask equipped with a condenser, a stirrer, and a temperature needle, add 40 parts of 2-ethylhexyl acrylate (EHA), 20 parts of 2-ethylhexyl methacrylate (EHMA), and 17 parts of butyl acrylate. ester (BA), 16 parts methyl methacrylate (MMA), 7 parts hydroxyethyl acrylate (HEA), 150 parts toluene and 1 part initiator benzoyl peroxide. Stir and heat up to 80°C, stir and react at this temperature for 4 hours, then react at 90°C for 3 hours, and obtain a glue with a solid content of 35-40% after cooling.

[0055] Take 100 parts of the above glue solution, add 3 parts of toluene diisocyanate TDI, and stir at room temperature for half an hour to obtain a coating composition. Use a back coater to coat the coating composition on a 10 μm polyester film. Dry in an oven for 10 minutes, cover and roll with a release paper to obtain a peelable slightly viscous pressure-sensitive adhesive film of the present invention.

[0056] The above pressure-sensitive adhesive fi...

Embodiment 2

[0058] In a three-neck flask equipped with a condenser, a stirrer, and a temperature needle, add 40 parts of 2-ethylhexyl acrylate (EHA), 20 parts of 2-ethylhexyl methacrylate (EHMA), and 17 parts of butyl acrylate. Ester (BA), 16 parts of methyl methacrylate (MMA), 7 parts of hydroxyethyl acrylate (HEA), 150 parts of toluene and 1 part of initiator benzoyl peroxide are stirred and heated to 80 ° C, and stirred at this temperature React for 4 hours, then react at 90°C for 3 hours, and obtain a glue solution with a solid content of 35-40% after cooling.

[0059] Take 100 parts of the above glue solution, add 2 parts of toluene diisocyanate TDI, and stir at room temperature for half an hour to obtain a coating composition. Use a back coater to coat the coating composition on a 10 μm polyester film. Dry in the drying tunnel for 10 minutes, cover with release paper and roll up to obtain the peelable slightly viscous pressure-sensitive adhesive film of the present invention.

[00...

Embodiment 3

[0062] In a three-neck flask equipped with a condenser, a stirrer, and a temperature needle, add 40 parts of 2-ethylhexyl acrylate (EHA), 20 parts of 2-ethylhexyl methacrylate (EHMA), and 17 parts of butyl acrylate. Ester (BA), 16 parts of methyl methacrylate (MMA), 7 parts of hydroxyethyl acrylate (HEA), 150 parts of toluene and 1 part of initiator benzoyl peroxide are stirred and heated to 80 ° C, and stirred at this temperature React for 4 hours, then react at 90°C for 3 hours, and obtain a glue solution with a solid content of 35-40% after cooling.

[0063] Take 100 parts of the above glue solution, add 4 parts of toluene diisocyanate TDI, and stir at room temperature for half an hour to obtain a coating composition. Use a back coater to coat the coating composition on a 10 μm polyester film. Dry in the drying tunnel for 10 minutes, cover with release paper and roll up to obtain the peelable slightly viscous pressure-sensitive adhesive film of the present invention.

[00...

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PUM

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Abstract

The present invention provides a heat resistance peeling mild adhesive pressure sensitive adhesive film for electronic manufacturing industry or package industry, and its manufacturing method, 2-ethylhexyl acrylate, methacrylic acid 2-ethylhexyl acrylate, butyl acrylate, methyl methacrylate and 2-hydroxyethyl acrylate copolymer liquid cement are prepared by solution polymerization process, then a coating composition is prepared by adding a toluene diisocyanate crosslinking agent, the mild adhesive pressure sensitive adhesive film is obtained by coating and drying, the peeling strength of the mild adhesive pressure sensitive adhesive film, the polyimide film and the pet film is above 300g/25mm, the peeling strength after ageing 1 hour also keeps above 37g/25mm, the any residual does not retain after peeling, the mild adhesive pressure sensitive adhesive film has mild adhesive ability under the high temperature 180 DEG C, 90 DEG C and the acid-base environment, having a convenient operation, being directly peeled.

Description

technical field [0001] The invention relates to a pressure-sensitive adhesive film and a preparation method thereof, in particular to a heat-resistant peelable micro-adhesive pressure-sensitive adhesive that can be directly peeled off without leaving residues without UV irradiation or heating after use. Membranes and methods for their preparation. Background technique [0002] The peelable micro-adhesive pressure-sensitive adhesive film used in the electronics industry can be attached to the surface of the TCP of the COF tape-carrying package of electronic components, and is used to carry the electronic components through the entire process of processing. After further processing is completed, it is hoped that the peelable micro-adhesive film can be easily removed without leaving any dirt on the surface of the device. This use feature determines that the peelable micro-adhesive film must have a certain adhesive strength, but the adhesive force should not be too large, it ca...

Claims

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Application Information

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IPC IPC(8): C09J7/02C09J133/06
Inventor 刘萍
Owner SHENZHEN DANBOND TECH
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