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Method for preparing 1,4-di(2,4-diaminophenoxy)benzenoid form self-plasticizing unsaturated polyimides powder

A kind of technology of diaminophenoxy, polyimide powder, applied in 1 field

Inactive Publication Date: 2008-10-22
DONGHUA UNIV +1
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  • Abstract
  • Description
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Problems solved by technology

The preparation method of 1,4-bis(2,4-diaminophenoxy)benzene-type self-reinforcing toughness unsaturated polyimide powder has not yet been published in the literature and patent reports

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  • Method for preparing 1,4-di(2,4-diaminophenoxy)benzenoid form self-plasticizing unsaturated polyimides powder
  • Method for preparing 1,4-di(2,4-diaminophenoxy)benzenoid form self-plasticizing unsaturated polyimides powder
  • Method for preparing 1,4-di(2,4-diaminophenoxy)benzenoid form self-plasticizing unsaturated polyimides powder

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Abstract

The invention discloses a method for making 1, 4-double (2,4-diamino phenoxy) phenyl type self-toughening unsaturated polyimide powder. The method mainly comprises the following steps that: 1) 1, 4-double (2,4-diamino phenoxy) phenyl, aromatic series binary primary amine and aromatic series binary anhydride as well as an organic compound containing unsaturated double bond are stirred and react in a strong polar aprotic organic solvent system at a temperature of between 20 and 140 DEG C to obtain a brown and ropy thermoset polyamide acid solution capable of cross bonding and curing; 2) the obtained polyamide acid solution is dehydrated, mild-aminated, powdered, filtered, washed and dried to obtain the 1,4-double (2,4-diamino phenoxy) phenyl type self- toughening unsaturated polyimide powder.

Description

1,4-bis(2,4-diaminophenoxy)benzene-type self-reinforced toughness unsaturated polyimide powder preparation method technical field The invention relates to a preparation method of a high-temperature-resistant organic polymer film, in particular to a preparation method of 1,4-bis(2,4-diaminophenoxy)benzene-type self-reinforcing toughness unsaturated polyimide powder. Background technique Polyimide is a class of polymers with excellent comprehensive properties. It has excellent heat resistance, low temperature resistance, solvent resistance, self-lubrication, radiation resistance and flame retardancy. At the same time, it also has very good mechanical and dielectric properties. Therefore, it is widely used in high-temperature and radiation-resistant materials such as spacecraft, satellites or space vehicles; advanced structural composite materials in aerospace, automotive, electromechanical, etc., C-level or 200-level and above electrical insulation materials, resistance Hig...

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Application Information

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IPC IPC(8): C08G73/10C08G73/12
Inventor 虞鑫海陈梅芳
Owner DONGHUA UNIV
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