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Preparation technique for high-strength high conductivity integral dispersion copper spot-welding electrode

A technology of spot welding electrode and preparation process, applied in the direction of electrode characteristics, etc., can solve problems such as difficult to meet the requirements of national defense and social development, complex manufacturing technology process, difficult material quality control, etc., to achieve high strength, low cost, internal oxidation short time effect

Inactive Publication Date: 2012-01-11
HENAN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the complex process of this manufacturing technology, it is difficult to control the quality of materials and the cost is very high, which greatly limits its popularization and application.
Most of the dispersed copper in the Chinese market is the product of American and Japanese companies, and the domestic scale is very small, which is difficult to meet the requirements of national defense and social development

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] The overall dispersed copper material in this example mainly contains Cu, Al and O elements, wherein Al and O exist in the form of the second phase of alumina, and its content: Al 2 o 3 , 0.74wt%; the balance is Cu;

[0033] The process for preparing the above integral dispersed copper material includes:

[0034] ① Mixing of oxidant and filler; ② Embedding; ③ Internal oxidation; ④ Hot extrusion.

[0035] The mixing of the oxidizing agent and filler: the oxidizing agent is industrial grade Cu 2 O, particle size +200 mesh. The filler is industrial grade Al 2 o 3 , particle size +200 mesh. The oxidizing agent and filler are weighed at a mixing ratio of 40%:60% (mass percentage). The mixed oxidant and filler were dried in a ZJ1013 constant temperature blast drying oven at 80°C for 1 hour. Then use the SVP-0.18 V-type powder mixer to mix for 4 hours.

[0036] The embedding is to grind the Cu-0.37wt%Al alloy rod with a diameter of 5mm through No. 400 sandpaper on the...

Embodiment 2

[0040] In this example, the overall dispersed copper material mainly contains Cu, Al and O elements, wherein Al and O exist in the form of the second phase of alumina, and its content: Al 2 o 3 , 0.5wt%; the balance is Cu;

[0041] The process for preparing the above integral dispersed copper material includes:

[0042] ① Mixing of oxidant and filler; ② Embedding; ③ Internal oxidation; ④ Hot extrusion precision forming.

[0043] The mixing of the oxidizing agent and filler: the oxidizing agent is industrial grade Cu 2 O, particle size +200 mesh. The filler is industrial grade Al 2 o 3 , particle size +200 mesh. The oxidizing agent and filler are weighed at a mixing ratio of 50%:50% (mass percentage). The mixed oxidant and filler were dried in a ZJ1013 constant temperature blast drying oven at a drying temperature of 80°C for 1 hour. Then use the SVP-0.18 V-type powder mixer to mix for 4 hours.

[0044] The embedding is to grind the Cu-0.25wt% Al alloy rod with the siz...

Embodiment 3Cu20

[0048] The overall dispersed copper material in this example mainly contains Cu, Al, Y and O elements, wherein Al and O exist in the form of the second phase of alumina, and its content: Al 2 o 3 , 0.60wt%; the balance is Cu. The process for preparing the above integral dispersed copper material includes:

[0049] ① Mixing of oxidant and filler, embedding in sand, ③ Internal oxidation, ④ Hot extrusion and precision forming.

[0050] The mixing of the oxidizing agent and filler: the oxidizing agent is industrial grade Cu 2 O, particle size +200 mesh. The filler is industrial grade Al 2 o 3 , particle size +200 mesh. The oxidizing agent and filler are weighed at a mixing ratio of 60%:40% (mass percentage). The mixed oxidant and filler were dried in a ZJ1013 constant temperature blast drying oven at 80°C for 1 hour. Then use the SVP-0.18 V-type powder mixer to mix for 4 hours.

[0051] Embedding: Polish the Cu-0.30wt%Al-0.05wt%Y rare earth copper-aluminum alloy rod with ...

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Abstract

The invention provides a preparation technique method for a high intensity and high conductive integral dispersing copper spot welding electrode which adopts Cu-Al alloy with low solid solubility or rare-earth copper alloy with low solid solubility; the content of aluminum is not more than 1.00wt percent; the adding amount of the rare-earth is not higher than 0.50wt percent; the rest is Cu. The preparation technique method includes: mixing an oxidizer and a loading agent; embedding; internal oxidation; cold (hot) extrusion (rolling) deformation; wherein, the oxidizer is industrial Cu2O; the loading agent is industrial Al2O3; the oxidizer and the loading agent are mixed and the Cu-Al alloy or the rare-earth copper alloy stick or plate is embedded; the mixing proportion of the oxidizer and the loading agent is (40-60) percent:(60 to 40) percent; sintering and the internal oxidation are carried out synchronously; the sintering temperature is 900 to 1000 DEG C; the internal oxidation timeis 4 to 20 hours. The dispersing copper spot welding electrode prepared by the technique method of the invention not only has the advantages of high intensity, high conductive property and high anti-intenerating temperature, but also has the advantages of short internal oxidation time, low cost and high efficiency.

Description

【Technical field】 [0001] The invention belongs to the technical field of alloy materials, and mainly relates to a preparation method of a high-strength and high-conductivity integral dispersed copper spot welding electrode. The integral dispersed copper spot welding electrode prepared by this method can be used in high-power electric vacuum tubes, microelectronic device pins, integrated circuit lead frames, microwave communications, power transmission and other fields, and has wide applications in national defense industry and electronic information industry. 【Background technique】 [0002] High-strength and high-conductivity copper-based composites are a new type of functional material with excellent comprehensive properties. They not only have excellent electrical conductivity, but also have high strength and superior high-temperature performance. With the development of the electronics industry, especially in the late 1970s, the American SCM company developed the Glidcop ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23P15/00B22F1/00B22F3/10C22C9/01B23K11/30
Inventor 田保红刘平刘勇宋克兴贾淑果任凤章李红霞张毅陈小红
Owner HENAN UNIV OF SCI & TECH