Redistribution structure and production method thereof, redistribution convex point and production method thereof

Abstract

A redistribution structure includes a wafer the surface of which is provided with a first passivation layer; a first cut arranged in the first passivation layer and exposes the surface of the wafer; a redistribution metal layer which is arranged on the first passivation layer and fills the first cut; a second passivation layer covering the redistribution metal layer; a second cut which is arranged in the second passivation layer and exposes the redistribution metal layer; the first cut and the second cut are distributed by offsetting. The invention also provides a forming method for the redistribution structure and a redistribution salient point comprising the redistribution structure as well as a forming method of the redistribution salient point. The structures of the redistribution structure and the redistribution salient point of the invention are simple; the technique steps for forming the redistribution structure and the redistribution salient point are less; the technique is simple.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a redistribution structure and a manufacturing method thereof, and a redistribution bump and a manufacturing method thereof. Background technique [0002] Wafer Level Chip Scale Package (WLCSP) is a CSP packaging technology that enables integrated circuits (ICs) to be mounted face down on a printed circuit board. The solder joints of the chip are soldered to the printed circuit board through independent solder balls. No fill material is required on the pad. The first advantage of this technology is that the inductance between the integrated circuit and the printed circuit board is very small, and the second advantage is that the package size and production cycle are reduced and the heat conduction performance is improved. [0003] With the gradual reduction of the size of integrated circuit chips and the continuous improvement of integration, the electronics industry has ...

AI Technical Summary

Problems solved by technology

[0008] The problem solved by the present invention is that the structure of the bump redistribution bump in the prior art is complex, there are many process steps, and the metal used in the redistribution route is relatively easy to be corroded.

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