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Manufacturing method of polymer member and polymer member

A manufacturing method and polymer technology, which can be used in liquid chemical plating, mechanical equipment, coatings, etc., can solve the problems of difficulty in obtaining strong adhesion between the coating and the molded product, difficulty in obtaining the physical pinning effect of the coating, and being uneconomical. Achieve the effect of ensuring coating reliability, ensuring adhesion, and suppressing excessive penetration

Inactive Publication Date: 2008-11-12
HITACHT MAXELL LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the case of performing electroless plating on such a polymer base material, only the metal particles present on the outermost surface of the polymer base material as catalyst nuclei for electroless plating, and the inside of the polymer base material (inside the surface) ) The metal particles present are the remaining catalyst nuclei and are uneconomical
In addition, in the case of forming a coating film on a polymer base material obtained by the technology described in Japanese Patent No. 3696878, since the surface of the polymer base material is not roughened, it is difficult to obtain a physical pinning effect of the coating film, and there are difficulties. Issues such as obtaining strong adhesion between the coating film and the molded product

Method used

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  • Manufacturing method of polymer member and polymer member
  • Manufacturing method of polymer member and polymer member
  • Manufacturing method of polymer member and polymer member

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0105] In this example, as a polymer base material, a holder of a camera lens unit used in a mobile phone, a digital camera, and the like was used. Schematic cross-sectional views of the polymer substrate of this example are shown in FIGS. 2A and 2B . As shown in FIGS. A and 2B , the camera lens assembly 101 is composed of a bracket 102 with an inner opening 108 , a lens 104 and a lens holder 103 for fixing the lens 104 . In addition, FIG. 2A is a diagram when the bracket 102 and the lens holder 103 are disassembled, and FIG. 2B is a diagram when the bracket 102 and the lens holder 103 are assembled. As shown in FIG. 2A , the lens holder 103 is provided with an inner opening 107 in which the lens 104 is fixed. In addition, an imaging element such as a C-MOS sensor (not shown) is fixed to the lower portion of the camera unit 101 .

[0106] As shown in FIG. 2A , a threaded groove 105 is formed on the outer wall of the lens holder 103 , and a threaded groove 106 matching the th...

Embodiment 2

[0135] In Example 2, as in Example 1, a method of forming an electroless plating film on the surface of a polymer base material by continuous processing will be described. In addition, in this example, a high-pressure vessel having a structure different from that of Example 1 was used as the high-pressure vessel in the plating apparatus. In addition, the electroless plating solution used in this example is the same as in Example 1. In addition, in this example, as in Example 1, a metal film is formed on the surface of the holder of the camera lens unit (the holder 102 having the structure shown in FIGS. 2A and 2B ). In addition, supercritical carbon dioxide is used as pressurized carbon dioxide introduced into the electroless plating solution.

[0136] Plating device

[0137] A schematic configuration diagram of a plating apparatus used in Example 2 is shown in FIG. 6 . As shown in FIG. 6 , the plating device 200 is mainly composed of a carbon dioxide pump 21, a filter 26, ...

Embodiment 3

[0151]In embodiment 3, except that surfactant is not added in electroless plating and electroless plating solution is not stirred by magnetic stirrer, use the same plating apparatus as embodiment 2, carry out on polymer base material by the same method Electroless plating treatment to prepare polymer parts.

[0152] In addition, even if the polymer parts prepared in this example were subjected to environmental tests (high temperature and high humidity test, heat cycle test) and adhesion evaluation (peeling test) in the same manner as in Example 2, similar to Example 2, it was found that 102 to form a high-adhesive coating. That is, it was found that according to the production method of the polymer part of the present invention, even without using a surfactant and a magnetic stirrer to improve the affinity (compatibility) of supercritical carbon dioxide and the electroless plating solution, it is also possible to form on the polymer substrate. Coating with good adhesion.

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Abstract

The present invention provides a method for manufacturing a polymer member, including: preparing a polymer substrate having metallic fine particles impregnated on and inside a surface thereof; bringing pressurized carbon dioxide into contact with the polymer substrate to swell a surface area of the polymer substrate; and bringing an electroless plating solution containing pressurized carbon dioxide and being in a state causing a plating reaction, into contact with the polymer substrate while the surface area of the polymer substrate is swollen, to form a plating film with high adhesive strength on the polymer substrate.

Description

technical field [0001] The present invention relates to a polymer part in which a coating film is formed on a plastic polymer substrate and a method for producing the same. Background technique [0002] Conventionally, an electroless plating method is known as a method for inexpensively forming a metal film on the surface of a polymer substrate (polymer molded article). However, in electroless plating, in order to ensure the adhesion of the coating film, as a pretreatment of electroless plating, it is necessary to etch the surface of the polymer substrate with an oxidizing agent such as hexavalent chromic acid or permanganic acid to etch the surface of the polymer substrate. roughening of the surface of the material. In addition, polymers that can be immersed in such an etching solution, that is, polymers to which electroless plating can be applied are limited to polymers such as ABS. This is because ABS contains a butadiene rubber component, which is dipped in an etching ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/16C23C18/20B29C45/16F16J12/00B32B5/00
Inventor 游佐敦野村善行水村哲夫大门英夫
Owner HITACHT MAXELL LTD
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