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Manufacture method of light emitting diode encapsulation having prefocus cup

A technology of light-emitting diodes and manufacturing methods, applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve the problems of internal component aging, light loss, etc., and achieve the effect of reducing light loss

Inactive Publication Date: 2008-11-19
BILLION BRIGHT OPTOELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the packaging of the above-mentioned known high-power light-emitting diodes has the following disadvantages: there is still residual air in the condenser cup 413, which causes the loss of light travel and the aging of internal components

Method used

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  • Manufacture method of light emitting diode encapsulation having prefocus cup
  • Manufacture method of light emitting diode encapsulation having prefocus cup
  • Manufacture method of light emitting diode encapsulation having prefocus cup

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Experimental program
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Embodiment Construction

[0025] figure 2 It is a flowchart of a method for manufacturing a light emitting diode package according to a preferred embodiment of the present invention, and the method includes the following steps.

[0026] Step 200 (refer to Figure 3A ), using an anisotropic wet etching method on a silicon wafer to produce a groove array 300 with a plurality of grooves, wherein the anisotropic wet etching method can use KOH or TMAH (tetramethylammonium hydroxide) to conduct. The silicon wafer can be an epitaxial silicon wafer, and the groove depth after anisotropic wet etching is 100-300 mm, and the groove angle θ is 15-140 degrees.

[0027] Step 202 (refer to Figure 3B ), a layer of light reflection layer 302 is plated on the groove array 300.

[0028] Step 204 (refer to Figure 3C ), grow a transparent insulating layer 304 on the light reflective layer 302 .

[0029] Step 206 (refer to Figure 3D ), in the grooves of each groove array 300 , metal bumps 306 are formed on the tr...

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PUM

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Abstract

Disclosed is a method to fabricate an LED enclosure which is provided with a focus ring. After the fabrication of a silicon pedestal which is provided with at least one groove, the LED is arranged in the groove; after combining the silicon pedestal with the heat-conducting plate which is provided with a plurality of through holes, the focus ring is installed on the heat-conducting plate to cover the silicon pedestal; air between the focus ring and the heat-conducting plate is extruded through the through holes. Since the LED is encased in vacuum condition, light loss can be reduced.

Description

technical field [0001] The invention relates to a method for manufacturing a light-emitting diode package, in particular to a method for making a light-emitting diode package with a focusing cup. Background technique [0002] Light emitting diodes (LEDs) have the advantages of high efficiency and low cost because they emit light using a direct bandgap and can be produced by a semiconductor process. With the successful research and development of blue light diodes and the increase in power, light-emitting diodes are gradually attracting people's attention in general lighting and backlight applications. [0003] see figure 1 , US Patent No. 20050274959 discloses a high-power LED package, whereby a high-power LED chip 401 is packaged. Such as figure 1 As shown, the high power LED package mainly includes a silicon submount 402 , a heat sink 409 and a condenser cup 413 . The silicon base 402 has grooves and electrodes (not numbered) located in the grooves. The LED chip 401 i...

Claims

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Application Information

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IPC IPC(8): H01L33/00H01L21/50
CPCH01L2224/48091H01L2224/73265H01L2224/97H01L2924/00014
Inventor 龚先进许弘宗
Owner BILLION BRIGHT OPTOELECTRONICS