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Copper alloy for electric and electronic equipments

A technology of copper alloy and electronics, which is applied in the field of copper alloy for electronic equipment and electrical, and can solve the problems of reduced strength and bending workability

Active Publication Date: 2013-02-06
FURUKAWA ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this invention is carried out by adjusting the solution heat treatment conditions to control the crystal grain size, and by reducing the amount of work solidification. As mentioned above, when Cu-Ni-Co-Si alloys need to be solid solution In the case of heat treatment, the strength and bending workability will decrease, so it is not applicable

Method used

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  • Copper alloy for electric and electronic equipments
  • Copper alloy for electric and electronic equipments
  • Copper alloy for electric and electronic equipments

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Embodiment 1

[0038] Each element is blended according to the composition shown in the table, and the balance is composed of Cu and unavoidable impurities. The alloy is melted in a high-frequency melting furnace and cast at a cooling rate of 0.1-100°C / sec to obtain an ingot. After holding the ingot at 900 to 1020°C for 3 minutes to 10 hours, hot working is performed, and then water quenching is performed, and in order to remove oxidized scale, face cutting is performed.

[0039] The subsequent process is to manufacture a copper alloy by performing the processes of processes A-1 to B-4 described below.

[0040] The manufacturing process includes one or more solution heat treatments. Among them, the processes are classified with the boundary of the last solution heat treatment before and after the final solution heat treatment. The process to the middle solution heat treatment is A process, and there are A-1 to A-6 processes. From the intermediate solution to the process B, there are processes B-1...

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Abstract

The present invention provides a copper alloy for electric and electronic equipments, containing from 0.5 to 4.0 mass% of Ni, from 0.5 to 2.0 mass% of Co, and from 0.3 to 1.5 mass% of Si, with the balance of copper and inevitable impurities, wherein R(200) is 0.3 or more, in which the R{200} is a proportion of a diffraction intensity from a (200) plane of the following diffraction intensities and is represented by R(200) = I{200} / (I{111} + I{200} + I{220} + I{311}), I{111} is a diffraction intensity from a {111} plane, I{200} is a diffraction intensity from a {200} plane, I{220} is a diffraction intensity from a {220} plane, and I{311} is a diffraction intensity from a {311} plane, each at the material surface.

Description

Technical field [0001] The invention relates to a copper alloy for electrical and electronic equipment. Background technique [0002] In the past, in addition to iron-based materials, copper-based materials such as phosphor bronze, red brass, and brass that have excellent electrical and thermal conductivity properties have been widely used in general electrical and electronic equipment materials. In recent years, the requirements for miniaturization, weight reduction, and high functionality of electrical and electronic equipment, and the accompanying high-density mounting, are increasing, and various characteristics are required for copper-based materials suitable for the above requirements. [0003] For example, with the increase in heat generation of CPUs, in order to dissipate heat, copper alloys used in CPU sockets and the like require electrical conductivity more than ever. In addition, the use environment of in-vehicle connectors has become more severe, and in order to impro...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C9/00
Inventor 金子洋江口立彦三原邦照广瀬清慈
Owner FURUKAWA ELECTRIC CO LTD