Method for preparing firm flexible printed board

Abstract

The invention discloses a method for producing rigid and flexible printed circuit boards, and comprises the following steps: a produced flexible circuit board and a produced rigid circuit board bond with each other by using bonding substrate; a second through-hole is drilled on a soft-hard combination area after the flexible circuit board and the rigid circuit board bond; peelable glue is printed and solidified on the exposed flexible circuit board, and then the second through-hole is blackened; the second through-hole and the outer surface of the substrate of the rigid circuit board is coated with copper, and then circuit etching is performed on the outer surface of the substrate of the rigid circuit board; the peelable glue is ripped off, so as to perform the subsequent grinding, welding resistance, gold immersion or electro-gilding technique. Based on the prior equipment in the FPC plant, before the second through-hole on the soft-hard combination area is blackened by the method for producing the rigid and the flexible printed circuit boards, the peelable glue is printed and solidified on the exposed flexible circuit board, thereby preventing carbon powder from being attached to a base film or a cover film of the fixable board in the blackening process, and realizing the protection for the exposed flexible circuit board.

Description

technical field [0001] The invention relates to a method for manufacturing a rigid-flex printed board. Background technique [0002] With the continuous development and innovation of Printed Circuit Board (PCB) and Flexible Printed Circuit Board (FPC) processing technology, Rigid-Flex Printed Circuit Board (Rigid-Flex Printed Circuit Board) came into being. The emergence of rigid-flex printed boards has brought new opportunities to solve the interconnection problem between functional modules of electronic equipment. Rigid-flex printed boards can be folded, bent, and crimped, so that circuits between different planes can be easily connected, and moving parts can also be connected to realize three-dimensional wiring, thereby solving many problems that were originally limited in packaging and improving connection density. , Enhance the reliability of electronic equipment. Moreover, the application of rigid-flexible printed boards to the bottom plate and sub-boards can reduce ...

AI Technical Summary

Problems solved by technology

This method is limited to making some samples in the development stage of soft and hard boards, and it is impossible to achieve mass production

Moreover, the method of sticking the tape itself has relatively large defects. First, the tape itself may have glue residue. If there is glue left on the gold finger pad on the second and third types of rigid-flex , it is difficult to plate gold in the follow-up gold plating process, which directly leads to quality problems; secondly, in order to provide sufficient mechanical strength, the rigid circuit board has a certain thickness, and

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