Adhesive composition, circuit connecting material and connecting structure of circuit member
A circuit connection material and adhesive technology, which is applied in the structural connection of printed circuits, conductive materials dispersed in non-conductive inorganic materials, printed circuit components, etc., can solve problems such as short circuit between adjacent electrodes, and prevent short circuits. , The effect of suppressing aggregation and excellent connection reliability
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Embodiment 1
[0145] [Preparation of Adhesive Composition]
[0146] As a radically polymerizable compound, 10 parts by mass of urethane acrylate (manufactured by Shin-Nakamura Chemical Industry Co., Ltd., trade name "UA-5500T") and 25 parts by mass of bis(acryloyloxyethyl)isocyanuric acid were prepared. Ester (manufactured by Toagosei Co., Ltd., trade name "M-215"), 10 parts by mass of dimethyloltricyclodecane diacrylate (manufactured by Kyoeisha Chemical Co., Ltd., trade name "DCP-A"), and 1 mass parts One part of mono(2-methacryloyloxyethyl) acid phosphate (manufactured by Kyoeisha Chemical Co., Ltd., trade name "P-2M"), as a free radical generator, prepared 2,5-di 4 parts by mass of a 50% by mass hydrocarbon diluted solution of methyl-2,5-bis(2-ethylhexanoyl peroxide) hexane (manufactured by NOF Corporation, trade name "Perhexa 25O"). In addition, 80 parts by mass of a solid content 40 of polyester polyurethane resin (manufactured by Toyobo Co., Ltd., trade name "UR8200") dissolved in a...
Embodiment 2～10
[0163] Except that the average particle diameter of conductive particles, the compounding amount of conductive particles, the average particle diameter of insulating particles and / or the compounding amount of insulating particles were replaced by the data shown in Tables 1 and 2, the circuit member was produced in the same manner as in Example 1. connection structure. About the connection structure of the obtained circuit member, it carried out similarly to Example 1, and measured connection resistance and adhesive force, and evaluated the presence or absence of a short circuit. The results are shown in Tables 1 and 2.
[0164] [Table 1]
[0165]
[0166] [Table 2]
[0167]
Embodiment 11
[0169] Change the blending amount of urethane acrylate from 10 parts by mass to 35 parts by mass, and change the blending amount of bis(acryloyloxyethyl) isocyanurate from 25 parts by mass to 0 parts by mass, that is, no compounding, except Other than that, it carried out similarly to Example 10, and the connection structure of a circuit member was manufactured. About the connection structure of the obtained circuit member, it carried out similarly to Example 1, and measured connection resistance and adhesive force, and evaluated the presence or absence of a short circuit. The results are shown in Table 2.
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