Microstructure resonant beam pressure sensor

A pressure sensor, resonant beam technology, applied in piezoelectric/electrostrictive/magnetostrictive devices, measurement of force by measuring the frequency change of stressed vibrating elements, semiconductor/solid-state device components, etc. Development requirements, failure to achieve the highest precision, low natural resonance frequency, etc., to achieve the effect of improving measurement accuracy and reducing measurement errors

Inactive Publication Date: 2009-01-21
XI AN JIAOTONG UNIV
View PDF0 Cites 25 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But at present, the highest accuracy in China is far from reaching this accuracy, the main reason is that the beams are made of silicon or silicon compounds, and their

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Microstructure resonant beam pressure sensor
  • Microstructure resonant beam pressure sensor
  • Microstructure resonant beam pressure sensor

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0011] The structural principle and working principle of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0012] See figure 1 The present invention includes an upper silicon wafer 11 and a lower silicon wafer 12 formed by bonding. The upper silicon wafer 11 includes a rectangular frame 15 and two symmetrical peninsulas 14 opened on the longitudinal centerline of the rectangular frame 15, made of titanium nitride Both ends of the two sets of resonant beams 13 arranged side by side are connected to two peninsulas 14 respectively. The lower silicon wafer 12 has a structure with a mouth-shaped frame 17, and a pressure film 16 is arranged in the mouth-shaped frame 17. The thickness of the mouth frame 17 is several times the thickness of the pressure membrane 16.

[0013] See figure 2 Each resonant beam 13 of the present invention is provided with an excitation resistor 20 and a vibration pickup resistor 21 connected to t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a micro-structure resonant beam pressure sensor, comprising an upper silicon slice and a lower silicon slice which are formed by linkage, wherein the upper silicon slice comprises a rectangular frame and two symmetrical peninsulas arranged in the rectangular frame; two groups of resonant beams which are made of titanium nitride and arranged side by side have two ends connected with the two peninsulas respectively; each resonant beam is respectively provided with a lead wire and a excitation resistance and a sensing resistance which are connected with electrodes; the lower silicon slice adopts a structure with an O-shaped frame, in which a pressure film arranged. In the invention, the titanium nitride is used as the resonant beams of the pressure sensor, and the titanium nitride has very high natural resonance frequency, the precision of the resonant type pressure sensor is greatly improved due to the use of the titanium nitride resonant beams. The measuring precision can be improved by increasing the natural resonance frequency, because higher the natural resonance frequency is, the bigger movement the corresponding zero pressure frequency has (the precision of the sensor is the specific value of the frequency instability and the movement of the corresponding zero pressure frequency) , and higher the measuring precision of the pressure is.

Description

technical field [0001] The invention relates to a miniature pressure sensor, in particular to a microstructure resonant beam pressure sensor capable of improving the precision of the miniature pressure sensor. Background technique [0002] The development of Micro Electro Mechanical Systems (MEMS for short) technology and the gradual maturity of processing technology have made it possible to develop MEMS sensors with high integration, low cost, light weight, small size and low power consumption. Become the trend of future sensor research. [0003] For micro-resonant pressure sensors, the external pressure to be measured does not directly act on the resonator, but indirectly changes the stiffness of the resonator through the pressure film, thereby changing the resonant frequency of the beam, so the change of the resonant frequency of the beam can be detected To achieve the purpose of detecting the external pressure, it belongs to the principle of secondary sensitivity. Its ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B81B7/02G01L1/10
Inventor 杨川郭灿
Owner XI AN JIAOTONG UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products