Encapsulation method for top radiation organic EL part
An encapsulation method and top emission technology, which can be applied to electric solid devices, electrical components, semiconductor devices, etc., can solve problems such as device cathode wear, and achieve the effects of low cost, simple process and short curing time.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Publication Date
- 2009-02-04
- Estimated Expiration
- Not applicable · inactive patent
Smart Images
Figure 1
Abstract
Description
technical field
[0001] The invention belongs to the field of organic electroluminescence, and in particular relates to a new packaging method for top-emitting organic electroluminescence devices. Background technique
[0002] Organic electroluminescent device (OLED) is a new type of flat display device newly developed at present. Because OLED can meet all the needs of people for displays, that is, it has the advantages of self-illumination, thinness, fast response, wide viewing angle, large-screen display, low-voltage DC drive, simple process, low cost, and flexible display. Therefore, It is considered to be the most ideal and most promising next-generation display technology. At present, there are two types of active OLED light-emitting structures: bottom-emitting and top-emitting. The anode ITO of the bottom-emitting device is below, followed by the OLED organic light-emitting layer, and the top is the metal or alloy cathode. In electroluminescence, light exits from the...
Examples
Embodiment 1
[0024] The preparation of the device is carried out in a multi-source organic molecular vapor deposition system. The detailed preparation process is as follows:
[0025] [1] The silicon substrate is repeatedly scrubbed with acetone, ethanol, and deionized water in sequence, ultrasonically, and then dried;
[0026] [2] Place the processed substrate in a multi-source organic molecular vapor deposition system (see Chinese patent: ZL03110977.2, "Crucible evaporation source for organic electroluminescence coating machine"), the same The vacuum chamber contains an organic evaporation area (8 evaporation sources) and a metal evaporation area (2 evaporation sources). The two areas and each evaporation source are isolated from each other to avoid mutual contamination. The substrate can be rotated to the organic evaporation area separately. The evaporation area or the upper part of the metal evaporation area is convenient for the growth of materials. The substrate is 25cm away from the ...
Embodiment 2
[0034] The preparation of the device is carried out in a multi-source organic molecular vapor deposition system. The detailed preparation process is as follows:
[0035] [1] The silicon substrate is repeatedly scrubbed with acetone, ethanol, and deionized water in sequence, ultrasonically, and then dried;
[0036] [2] Place the processed substrate in a multi-source organic molecular vapor deposition system. The same vacuum chamber of the system contains an organic evaporation area (8 evaporation sources) and a metal evaporation area (2 evaporation sources). The areas and the evaporation sources are isolated from each other to avoid mutual pollution. The substrate can be rotated to the upper part of the organic evaporation area or the metal evaporation area to facilitate the growth of materials. The substrate is 25cm away from the evaporation source and can rotate and revolve to ensure The uniformity of the metal film and the organic film, the materials used are placed in diffe...
Embodiment 3
[0043] The preparation of the device is carried out in a multi-source organic molecular vapor deposition system. The detailed preparation process is as follows:
[0044] [1] The silicon substrate is repeatedly scrubbed with acetone, ethanol, and deionized water in sequence, ultrasonically, and then dried;
[0045] [2] Place the processed substrate in a multi-source organic molecular vapor deposition system. The same vacuum chamber of the system contains an organic evaporation area (8 evaporation sources) and a metal evaporation area (2 evaporation sources). The areas and the evaporation sources are isolated from each other to avoid mutual pollution. The substrate can be rotated to the upper part of the organic evaporation area or the metal evaporation area to facilitate the growth of materials. The substrate is 25cm away from the evaporation source and can rotate and revolve to ensure The uniformity of the metal film and the organic film, the materials used are placed in diffe...