Flat hot pipe for cooling electron device and processing technology thereof

A flat-plate heat pipe and electronic device technology, applied in metal processing equipment, manufacturing tools, indirect heat exchangers, etc., can solve the problems of high cost and complex system, reduce material consumption, large heat transport volume, and reduce material cost Effect

Active Publication Date: 2009-02-11
GUANGWEI HETONG ENERGY TECH BEIJING CO LTD
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  • Abstract
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  • Flat hot pipe for cooling electron device and processing technology thereof
  • Flat hot pipe for cooling electron device and processing technology thereof
  • Flat hot pipe for cooling electron device and processing technology thereof

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[0025] The present invention will be further described below with reference to the accompanying drawings.

[0026] like figure 1 Shown is a schematic diagram of the structure of the flat heat pipe of the present invention.

[0027] The heat-absorbing section of the heat-absorbing plate 1 is closely attached to the heating surface of the electronic components through thermal conductive silica gel. The fan 3 is arranged on the upper part of the outer fin 5 of the flat-plate heat pipe, and the fan 3 absorbs the heat-absorbing plate of the flat-plate heat pipe by means of convection heat exchange. of heat is dissipated into the atmosphere.

[0028] The flat frame of the heat absorbing plate 1 is provided with inner fins 4, and the inner fins 4 are located between the upper and lower end faces of the frame. The inner fins 4 shown in the figure are plates with a W-shaped corrugated structure. The peaks and valleys of the corrugated structure are respectively connected to the inner...

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Abstract

The invention provides a flat heat tube used for cooling a high-power electronic device, which comprises a frame of the flat heat tube, wherein, the upper end surface of the frame is provided with a cooling surface. The flat heat tube is characterized in that: an inner fin is arranged in the frame of the flat heat tube, and is positioned between the upper end surface and the lower end surface of the frame; the inner fin separates the inner space of the frame into a plurality of poroid channels; the inside of the frame is a vacuum structure and is filled with liquid working substance; the lower end surface of the flat heat tube is directly connected with a heat emitting surface of the electronic device; a fan is arranged above the upper end surface of the flat heat tube so as to disperse heat into atmosphere by the mode of forced convection. The flat heat tube has the characteristics of super thinness, high efficiency and large heat transfer capacity, and can replace an oscillating heat tube and a common heat tube.

Description

technical field [0001] The invention relates to the cooling technology of electronic devices, in particular to a flat heat pipe used for heat dissipation of high-power electronic devices with high integration level under high heat flux density and its processing technology. Background technique [0002] With the high frequency and high speed of electronic devices, the rapid development of integrated circuit technology and the advancement of MEMS (MicroElectronic Mechanical System) technology, the heat generation and heat flux density of electronic devices per unit volume have increased significantly, and the layout and design of heat dissipation devices have encountered difficulties. more and more constraints. Taking the design of microelectronic chips as an example, it has generally reached (60-100) W / cm 2 , up to 200W / cm 2 above. Traditional heat dissipation methods such as air cooling (forced convection), because their cooling efficiency is proportional to the speed of...

Claims

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Application Information

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IPC IPC(8): F28D15/02B23K1/008
Inventor 赵耀华刁彦华张楷荣
Owner GUANGWEI HETONG ENERGY TECH BEIJING CO LTD
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