Containing chamber structure for transfer container

Abstract

The invention relates to an accommodating chamber structure for a shifting container, particularly to an accommodating chamber structure capable of controlling the internal environment of the shifting container by using an additive. The shifting container comprises a base, and a casing cover which selectively covers the base to form an accommodating space for accommodating an article and is composed of a casing and an inner lining corresponding to the accommodating space; at least a filling portion is arranged on the inner lining for accommodating the additive; and a plurality of through-holes are formed on the circumferential edge of the filling portion and communicate with the accommodating space, so that the additive inside the filling portion can react with the internal environment of the accommodating space via the through-holes to eliminate or adsorb or neutralize harmful substances inside the shifting container, which are released due to intrinsic factors of the container or manufacturing process factors. Therefore, the accommodating chamber structure can improve the internal cleanliness of the shifting container.

Description

technical field [0001] The invention relates to a technical field for controlling the internal environment of a container for placing photomasks or wafers, in particular to a kind of additive that can be placed inside to absorb, eliminate or neutralize harmful substances in the environment for improving or The structure of the transfer container accommodating chamber that maintains the cleanliness of the accommodating space next to the photomask or wafer. Background technique [0002] According to, in the semiconductor manufacturing process, the harmful substances released by the particles, water vapor or various solvents in the environment will directly affect the yield rate of the output, and in order to deal with these harmful substances, manufacturers need additional cleaning Or remanufacture the process, and increase its operating cost. In order to solve this problem, the general semiconductor process needs to be carried out in a very high-level clean room, but due to t...

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Problems solved by technology

[0007] However, improving the airtightness of the structure of the transfer container is a major project, which not only needs to increase the cost of development, molding and assembly, but is also affected by factors such as material, sealing force and contact area of ​​the sealing. The transfer container cannot achieve a completely airtight effect, so the gas in the transfer container will still gradually leak out. Since the particles and water molecules are extremely small, after a long period of storage in the transfer container, the external environment such as particles Harmful substances such as water molecules will still gradually seep into the transfer container, and lose the effect of maintaining the cleanliness of the photomask

Furthermore, the materials used for the transfer container and the mask pattern contain harmful substances such as sulfur and ammonia. These harmful substances will be released continuously. But after a long time, these harmful substances will affect the inside of the transfer container. mask, which will also cause contamination, atomization, and crystallization of the mask and mask protective film, which will further affect the yield, yield, and cost of subsequent wafer processing.

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