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Room temperature vulcanized organosilicon pouring sealant for LED

A technology of silicone potting glue and room temperature vulcanization, which is applied in other chemical processes, chemical instruments and methods, electrical components, etc., can solve the problems of fragile components, shortened service life, poor heat resistance, etc., and achieve simple manufacturing process, Extended service life and good packaging effect

Active Publication Date: 2009-03-11
SHANGHAI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Low-cost epoxy resin materials are mostly used in LED potting adhesives, but epoxy resins have poor heat resistance at high temperatures and poor moisture resistance, and there are many problems in the packaging and application of LEDs.
Poor heat resistance will easily damage the components, shorten the service life, poor moisture resistance, water vapor can easily enter the interior of the device, and easily cause short circuits and other problems

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] Example 1: Take 100g of vinyl-terminated polymethylphenylsiloxane with a viscosity of 1000mpa.s (25°C), and vinyldimethylsiloxy-terminated polymethylphenylsiloxane with a viscosity of 800mpa.s (25°C). 10g of dimethylsiloxane, 10g of polymethylhydrophenylsiloxane with a viscosity of 100mpa.s (25°C), and 0.2g of inhibitor methylbutynol were mixed uniformly at room temperature to prepare component A; 100g of vinyl-terminated polymethylphenylsiloxane with a viscosity of 1000mpa.s (25°C), and vinyldimethylsiloxy-terminated polydimethylsiloxane with a viscosity of 800mpa.s (25°C) 10 g of alkane, 2.0 g of methylvinylsiloxane-coordinated platinum catalyst with a catalyst platinum content of 2000 ppm were mixed uniformly at room temperature to prepare component B.

[0014] Mix component A and component B evenly at a weight ratio of 1:1, remove air bubbles, pour into a mold of 2mm×10mm×10mm, cure at room temperature for 8 hours, and make it into a silicone sheet.

Embodiment 2

[0015] Example 2: Take 100 g of vinyl-terminated polymethylphenylsiloxane with a viscosity of 1400mpa.s (25°C), and vinyldimethylsiloxy-terminated polymethylphenylsiloxane with a viscosity of 500mpa.s (25°C). 15g of dimethylsiloxane, 15g of polymethylhydrophenylsiloxane with a viscosity of 200mpa.s (25°C), and 0.1g of inhibitor methylbutynol were mixed uniformly at room temperature to prepare component A; 100g of vinyl-terminated polymethylphenylsiloxane with a viscosity of 1400mpa.s (25°C), and vinyldimethylsiloxy-terminated polydimethylsiloxane with a viscosity of 500mpa.s (25°C) 15 g of alkane and 3.0 g of a methylvinylsiloxane-coordinated platinum catalyst with a catalyst platinum content of 1500 ppm were mixed uniformly at room temperature to prepare component B.

[0016] Mix component A and component B evenly at a weight ratio of 1:1, remove air bubbles, inject into a mold of 2mm×10mm×10mm, cure at room temperature for 6 hours, and shape it into a silicone sheet.

Embodiment 3

[0017] Example 3: Take 100 g of vinyl-terminated polymethylphenylsiloxane with a viscosity of 800mpa.s (25°C), and vinyldimethylsiloxy-terminated polymethylphenylsiloxane with a viscosity of 1200mpa.s (25°C). 20g of dimethylsiloxane, 8g of polymethylhydrophenylsiloxane with a viscosity of 300mpa.s (25°C), and 0.4g of inhibitor methylbutynol were mixed uniformly at room temperature to prepare component A; Take 300g of vinyl-terminated polymethylphenylsiloxane with a viscosity of 800mpa.s (25°C), vinyldimethylsiloxy-terminated polydimethylsiloxane with a viscosity of 1200mpa.s (25°C) 20 g of oxane, 1.5 g of a methylvinylsiloxane-coordinated platinum catalyst with a catalyst platinum content of 2500 ppm were uniformly mixed at room temperature to prepare component B.

[0018] Mix component A and component B evenly at a weight ratio of 1:1, remove air bubbles, pour into a mold of 2mm×10mm×10mm, and cure at room temperature for 10 hours to form it into a silicone sheet.

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Abstract

The invention relates to a room temperature vulcanized (RTV) organosilicon potting adhesive for an LED. The potting adhesive is a bi-component potting adhesive, wherein a component A is formed by mixing vinyl terminated polymethylphenyl sioxane, vinyl dimethyl methylsiloxy terminated PDMS, polymethyl hydrogen phenyl siloxane and methyl-butynol as inhibitor in the weight ratio of 100:10-30:5-20:0.05-1; and a component B is formed by mixing vinyl terminated polymethylphenyl sioxane, vinyl dimethyl methylsiloxy terminated PDMS and methyl vinyl siloxane coordinated platinum catalyst in the weight ratio of 100:10-30:0.5-5. The RTV organosilicon potting adhesive for the LED has the advantages of good heat resistance, wet fastness, light transmittance up to 99 percent, refractive index up to 1.47 to 1.55, good packaging effect, capability of prolonging the life span of the LED, as well as simple manufacture process.

Description

field of invention [0001] The invention relates to a potting material for electronic packaging, in particular to a room temperature vulcanized silicone potting glue for LEDs. Background technique [0002] Most LED potting adhesives use low-cost epoxy resin materials, but epoxy resins have poor heat resistance at high temperatures and poor moisture resistance, and there are many problems in the packaging and application of LEDs. Poor heat resistance will easily damage the components, shorten the service life, poor moisture resistance, water vapor can easily enter the interior of the device, and easily cause short circuits and other problems. With the vigorous development of the semiconductor lighting industry and the continuous emergence of lighting-level LED devices that require high power, high brightness, and long life, a high-performance packaging material is needed to meet the requirements of LED packaging. Contents of the invention [0003] The object of the present ...

Claims

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Application Information

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IPC IPC(8): C08L83/07C09K3/10H01L33/00C08L83/05
Inventor 李清华张建华
Owner SHANGHAI UNIV
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