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Organosilicon solvent-free dip varnish by modification of nano material and preparation method thereof

A technology of solvent-free impregnating paint and nanomaterials, applied in coatings and other directions, can solve problems such as low thermal conductivity, and achieve the effect of improving thermal conductivity, good mechanical and electrical properties, and excellent thermal conductivity.

Active Publication Date: 2009-03-11
ZHUZHOU TIMES ELECTRIC INSULATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is mainly to solve the problem of low thermal conductivity in the existing silicone impregnating paint technology, and to provide a solvent-free impregnating silicone with high thermal conductivity Lacquer and its preparation method

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] A nanomaterial-modified organosilicon solvent-free dipping varnish, comprising component A and component B:

[0029] The component A is mixed by the following components in parts by weight:

[0030] Silicone prepolymer 100 parts

[0031] Thermally conductive filler slurry 20 parts

[0032] Catalyst 0.1 parts

[0033] The component B is mixed by the following components in parts by weight:

[0034] Silicone prepolymer 100 parts

[0035] Thermally conductive filler slurry 20 parts

[0036] Curing agent 0.1 part

[0037] The silicone prepolymer contains two groups: Si-CH=CH 2 Based and Si-H based silicone prepolymers, silicone prepolymers are addition-cured under the combined action of catalysts and curing agents.

[0038] The thermally conductive filler slurry is composed of: 100 parts of solvent, 10 parts of thermally conductive filler, and 5 parts of coupling agent. The three components are mixed and ground to obtain a uniformly dispersed thermally conductive fil...

Embodiment 2

[0045] A nanomaterial-modified organosilicon solvent-free dipping varnish, comprising component A and component B:

[0046] The component A is mixed by the following components in parts by weight:

[0047] Silicone prepolymer 100 parts

[0048] Thermally conductive filler slurry 30 parts

[0049] Catalyst 0.3 part

[0050] The component B is mixed by the following components in parts by weight:

[0051] Silicone prepolymer 100 parts

[0052] Thermally conductive filler slurry 20 parts

[0053] Curing agent 0.3 part

[0054] The silicone prepolymer contains two groups: Si-CH=CH 2 Based and Si-H based silicone prepolymers, silicone prepolymers are addition-cured under the combined action of catalysts and curing agents.

[0055] The thermally conductive filler slurry is composed of: 100 parts of solvent, 20 parts of thermally conductive filler, and 15 parts of coupling agent. The three components are mixed and ground to obtain a uniformly dispersed thermally conductive fil...

Embodiment 3

[0062]A nanomaterial-modified organosilicon solvent-free dipping varnish, comprising component A and component B:

[0063] The component A is mixed by the following components in parts by weight:

[0064] Silicone prepolymer 100 parts

[0065] Thermally conductive filler slurry 80 parts

[0066] Catalyst 5.0 parts

[0067] The component B is mixed by the following components in parts by weight:

[0068] Silicone prepolymer 100 parts

[0069] Thermally conductive filler slurry 80 parts

[0070] Curing agent 5.0 parts

[0071] The silicone prepolymer contains two groups: Si-CH=CH 2 Based and Si-H based silicone prepolymers, silicone prepolymers are addition-cured under the combined action of catalysts and curing agents.

[0072] The thermally conductive filler slurry is composed of: 100 parts of solvent, 50 parts of thermally conductive filler, and 30 parts of coupling agent. The three components are mixed and ground to obtain a uniformly dispersed thermally conductive fi...

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Abstract

The invention relates to nano-material modified organic silicon solvent free impregnating varnish and a preparation method thereof. The nano-material modified organic silicon solvent free impregnating varnish comprises a composition A and a composition B. The composition A is produced by mixing the following compositions in weight portion: 100 portions of a silicone prepolymer, 10 to 80 portions of serous fluid of a heat-conducting filler and 0.1 to 5 portions of a catalyst; and the composition B is produced by mixing the following compositions in weight portion: 100 portions of the silicone prepolymer, 10 to 80 portions of the serous fluid of the heat-conducting filler and 0.1 to 5 portions of a curing agent. The varnish is mainly applied to a high-end electric motor. A curing material of the varnish has good mechanical performance and electrical performance and excellent heat conducting performance which is in particular prominent. The method adopts the mixing of the heat-conducting filler serous fluid and the silicone prepolymer in order that the heat-conducting filler is dispersed in the silicon impregnating varnish more evenly, thereby forming an effective heat-conducting passage and improving the heat conducting performance of a composite material.

Description

technical field [0001] The invention relates to a paint chemical raw material and a preparation method thereof, in particular to a nano-material modified organosilicon solvent-free impregnating paint and a preparation method thereof, which are mainly used in the insulation impregnation treatment of high-end motor winding coils. Background technique [0002] Impregnation varnish is a kind of insulating material, which is mainly used in the insulation impregnation treatment of motors, transformers and discrete winding coils, mainly for electrical insulation and bonding. Electrical insulation dipping varnishes include solvent-based varnishes and solvent-free varnishes. Due to the solvent-containing paint, its curing volatile content is relatively high, its viscosity can be very low, and it has good permeability to electrical coils and windings, but the baking time is long, the mechanical and electrical properties of the baked workpiece are poor, and there are some problems duri...

Claims

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Application Information

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IPC IPC(8): C09D183/04C09D5/25C09D5/00
Inventor 王文进李鸿岩衷敬和姜其斌
Owner ZHUZHOU TIMES ELECTRIC INSULATION
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