Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Reflection-permeation array substrate and method for manufacturing same

A technology of an array substrate and a manufacturing method, which is applied to the field of retro-transmissive array substrate and its manufacturing, can solve the problems of rising manufacturing cost and difficulty in setting, and achieve the effects of improving quality, reducing the problem of rising cost and reducing resin engineering.

Active Publication Date: 2009-04-01
BOE TECH GRP CO LTD +1
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The purpose of the present invention is to provide a transflective array substrate and its manufacturing method, which can effectively overcome the problems in the prior art that the setting of various parameters is too difficult and the problem of rising manufacturing costs caused by temperature control engineering

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Reflection-permeation array substrate and method for manufacturing same
  • Reflection-permeation array substrate and method for manufacturing same
  • Reflection-permeation array substrate and method for manufacturing same

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0037] figure 1 It is a structural schematic diagram of the first embodiment of the anti-transmissive array substrate of the present invention. Such as figure 1As shown, the anti-transmissive array substrate includes: a soft substrate 1 and an array body, wherein the soft substrate 1 is provided with a transmissive area and a reflective area, and embossing is formed on the soft substrate 1 corresponding to the reflective area, and the formed embossing is formed by a concave The pit is formed, and a reflector 7 with uniform thickness is arranged on the embossing. The main body of the array is located on the side of the soft substrate 1 provided with the reflector 7. The array main body includes a grid line (not shown in the figure), a grid electrode 2, and a grid insulator. Layer 3, active layer 4, source and drain electrodes 5, data lines (not shown in the figure), passivation layer 8 and pixel electrodes 9; the main structure of the array is specifically: set on the soft s...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to an anti-penetration typed array substrate and a preparation method thereof; the anti-penetration typed array substrate comprises a soft substrate and an array mainbody which is arranged on the soft substrate; the soft substrate is provided with a penetration area and a reflection area; the reflection area of the soft substrate forms an emboss which is provided with a reflection plate; the emboss, the reflection plate and the array mainbody are arranged on the same surface of the soft substrate; the preparation method of the anti-penetration typed array substrate comprises the steps as follows: the emboss is formed on the soft substrate and the array mainbody is formed on the soft substrate; wherein, the emboss is formed on the soft substrate by the detailed steps as follows: step 101: the soft substrate and a neilsbed are arranged; the soft substrate is provided with the penetration area and the reflection area; the neilsbed is heated to 150-200 DEG C; step 102: the neilsbed is pressed and stamped on the reflection area of the soft substrate to form the emboss; and step 103: the reflection is formed on the emboss. The anti-penetration typed array substrate and the preparation method thereof solve the problem that all parameters of the anti-penetration typed array substrate of the prior art are greatly difficult to be arranged and reduce the preparation cost of the anti-penetration typed array substrate.

Description

technical field [0001] The present invention relates to an array substrate and a manufacturing method thereof, in particular to an anti-transmission array substrate and a manufacturing method thereof. Background technique [0002] The liquid crystal display device is one of the most used flat panel display devices at present. It is mainly composed of two substrate structures and a liquid crystal layer injected between the substrate structures. The two substrate structures are provided with electrodes that can generate an electric field, and the electrodes generate a voltage. The liquid crystal molecules in the rear liquid crystal layer move with the electric field, and the liquid crystal molecules rotate in a certain direction under the action of the electric field, so that light passes through the liquid crystal layer according to a certain refractive index. [0003] Liquid crystal display devices can be classified into transmissive type, anti-transmissive type and reflecti...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/1333G03F7/00B29C59/00
Inventor 刘圣烈崔莹石
Owner BOE TECH GRP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products