43results about How to "Simplify Manufacturing Engineering" patented technology

A thermo-therapeutic apparatus is provided. The thermo-therapeutic apparatus according to one embodiment of the present disclosure includes a first supporting plate having a plurality of through holesformed therein and formed of skin foam; a front cover disposed on the first supporting plate so that one side of the first supporting plate is exposed, and to which the first supporting plate is coupled; a plurality of ceramics each insertion-fixed to the plurality of through holes, and each configured to protrude to the outside of the first supporting plate to a predetermined height; a heater disposed on one sides of the plurality of ceramics and configured to heat the plurality of ceramics; a second supporting plate disposed on one side of the heater and including a vibrator; and a rear cover disposed on one side of the second supporting plate and coupled to the front cover.

The invention discloses a butterfly lock which comprises a master lock and an auxiliary lock, wherein a spring and a lock core are arranged on the master lock; two grooves I are arranged at both sides of the master lock; a groove II is arranged between the two grooves I; the depth of the groove II is more than the depth of the grooves I; the front surface of the groove II is closed to arrange the lock core; the spring passes through the structure edge of the groove II and is fixed in the groove II; the lock core is fixed on the spring; and a lock latch of the lock core latches the master lock and the auxiliary lock together. Two levels of grooves (grooves I and groove II) are arranged on the master lock of the butterfly lock provided by the invention, thus not only the aesthetic property is increased, but also the safety factor is increased; an accident that the spring scratches people can not occur; and a base structure in the traditional structure is not provided, thereby simplifying the manufacturing process and reducing the product cost.

The invention relates to an air conditioner comprising a stand, a blowing fan, a fan motor and a motor cover, wherein the stand is provided with a fan wind passage part and a motor mounting part; the blowing fan is located in the fan wind passage part; the fan motor is connected with the blowing fan and is mounted in the motor mounting part; the motor cover is combined with the stand and covers the fan motor; the motor cover is provided with a front cable bracket part for fixing part of the cables and a lateral cable bracket part for fixing the rest cables. In the air conditioner, the cables connected with a control part are fixed dispersedly and are accommodated in the front cable bracket part and the lateral cable bracket part formed in the motor cover so as to simply arrange cables around the motor cover on the motor cover.

The present invention provides a thermotherapy bed comprising, in order to facilitate the storage and movement of the thermotherapy bed by maximizing space utilization and minimizing the volume of thethermotherapy bed: a bed main body in which a thermotherapy device is provided; side frames which are respectively connected to both side surfaces of the bed main body; and bed legs, which are respectively connected to the side frames, for supporting the bed main body, wherein the thermotherapy device is disposed in the center portion of the bed main body, thereby forming a step on the lower surface of the bed main body, and the bed legs are folded toward the inside of the bed main body so as to be received in spaces provided on both sides of the thermotherapy device.

The present invention relates to a door hinge, and more particularly, to a door hinge which is easy to assemble and small in size, and which can prevent high-temperature heat from being radiated from the inside of an appliance to which the door hinge is attached by applying a closing force to a door when the door is opened.

The invention relates to an anti-penetration typed array substrate and a preparation method thereof; the anti-penetration typed array substrate comprises a soft substrate and an array mainbody which is arranged on the soft substrate; the soft substrate is provided with a penetration area and a reflection area; the reflection area of the soft substrate forms an emboss which is provided with a reflection plate; the emboss, the reflection plate and the array mainbody are arranged on the same surface of the soft substrate; the preparation method of the anti-penetration typed array substrate comprises the steps as follows: the emboss is formed on the soft substrate and the array mainbody is formed on the soft substrate; wherein, the emboss is formed on the soft substrate by the detailed steps as follows: step 101: the soft substrate and a neilsbed are arranged; the soft substrate is provided with the penetration area and the reflection area; the neilsbed is heated to 150-200 DEG C; step 102: the neilsbed is pressed and stamped on the reflection area of the soft substrate to form the emboss; and step 103: the reflection is formed on the emboss. The anti-penetration typed array substrate and the preparation method thereof solve the problem that all parameters of the anti-penetration typed array substrate of the prior art are greatly difficult to be arranged and reduce the preparation cost of the anti-penetration typed array substrate.

The invention relates to an anti-penetration typed array substrate and a preparation method thereof; the anti-penetration typed array substrate comprises a soft substrate and an array mainbody which is arranged on the soft substrate; the soft substrate is provided with a penetration area and a reflection area; the reflection area of the soft substrate forms an emboss which is provided with a reflection plate; the emboss, the reflection plate and the array mainbody are arranged on the same surface of the soft substrate; the preparation method of the anti-penetration typed array substrate comprises the steps as follows: the emboss is formed on the soft substrate and the array mainbody is formed on the soft substrate; wherein, the emboss is formed on the soft substrate by the detailed steps as follows: step 101: the soft substrate and a neilsbed are arranged; the soft substrate is provided with the penetration area and the reflection area; the neilsbed is heated to 150-200 DEG C; step 102: the neilsbed is pressed and stamped on the reflection area of the soft substrate to form the emboss; and step 103: the reflection is formed on the emboss. The anti-penetration typed array substrateand the preparation method thereof solve the problem that all parameters of the anti-penetration typed array substrate of the prior art are greatly difficult to be arranged and reduce the preparationcost of the anti-penetration typed array substrate.

The invention provides a resistive random-access memory device and a manufacturing method thereof. The resistive random-access memory includes a plurality of pillars, a plurality of bit lines, and a memory cell. The pillars extend vertically along the main surface of the substrate. The bit lines extend in a horizontal direction. The memory cell is formed at the intersection of the pillars and the bit lines. The memory cell includes a gate insulating film, a semiconductor film, and a resistive element. The gate insulating film is formed on the circumference of the pillar. The semiconductor film is formed on the circumference of gate insulating film and provides a channel area. The resistive element is formed on the circumference of the semiconductor film. A first electrode area on the circumference of the resistive element and a second electrode area facing the first electrode area are electrically connected to a pair of adjacent bit lines.

The invention discloses a liquid crystal display panel, which comprises an active matrix, a first electrode, a second electrode, a first vertical alignment film, a second vertical alignment film and a layer of liquid crystal layers. The first electrode has a plurality of first electrode parts. The second electrode has a plurality of second electrode parts, and the second electrode parts are arranged in parallel with the first electrode parts at a predetermined interval. By applying an AC voltage to the first and second electrodes, the direction of the transverse electric field formed by any adjacent first electrode portion and second electrode portion is parallel to the surface of the first substrate. The first vertical alignment film is disposed on the first substrate and covers the first and second electrodes. The second vertical alignment film is disposed on the second substrate. The smectic liquid crystal layer is disposed between the first and second substrates. During the phase transition process of the liquid crystal molecules in the smectic liquid crystal layer, the transverse electric field generated by applying the AC voltage to the first and second electrodes assists the alignment of the liquid crystal molecules in the smectic liquid crystal layer.