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Laser cyclotomic apparatus and method thereof

A laser and equipment technology, applied in the field of laser micromachining equipment, can solve the problems of low cutting efficiency and cutting quality, and difficulty in reaching the bottom of the cut by laser energy.

Active Publication Date: 2009-04-15
HANS LASER TECH IND GRP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In order to overcome the technical problem that the laser energy in the prior art laser circle cutting method is difficult to reach the bottom of the cut, resulting in low cutting efficiency and cutting quality, the present invention provides a laser circle cutting equipment and its method that can improve cutting efficiency and cutting quality

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  • Laser cyclotomic apparatus and method thereof
  • Laser cyclotomic apparatus and method thereof
  • Laser cyclotomic apparatus and method thereof

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Embodiment Construction

[0022] Such as figure 1 as shown, figure 1 It is a structural schematic diagram of the laser circle cutting equipment of the present invention. The laser circle cutting equipment of the present invention includes a workbench 10 for supporting the material 2 to be cut (for example, a wafer), and the workbench 10 can drive the material 2 to be cut to rotate around the central axis of the workbench 10 . In addition, the laser circle cutting device further includes a laser 11 , a beam expander 12 , a cylindrical lens 13 , a reflecting mirror 14 and a focusing lens 15 . The laser 11 can generate a laser beam with wavelength, energy density, pulse time and repetition frequency suitable for cutting the material 2 to be cut. For example, the laser 11 can be a diode-pumped triple frequency solid laser with an operating wavelength of 355nm. The laser beam emitted by the laser 11 is incident on the cylindrical lens 13 after being expanded by the beam expander 12 . Cylindrical lens 13 ...

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Abstract

The invention relates to laser circuit cutting equipment and a method thereof. The laser circle-cutting equipment comprises a work table used to support and rotate a material to be cut, a laser used to generate a laser beam, a guiding mechanism used to guide the laser beam and a focusing mechanism used to focus the laser beam and form a focus light spot on the surface of the cut material, wherein the guiding mechanism comprises a reflector and a driving mechanism which deflects the reflector so as to widen the width of a notch formed by the focus light spot. Due to the adoption of the structure, the focus light sport is deviated a certain distance by deflecting the reflector, thereby widening the width of the notch, making more laser energy irradiate the bottom part of the notch, effectively reducing the generation of remelted layers on both sides of the notch and simultaneously improving the cutting efficiency and quality.

Description

【Technical field】 [0001] The invention relates to a laser microprocessing device, in particular to a laser circle cutting device and a method thereof. 【Background technique】 [0002] In recent years, with the rapid development of the semiconductor industry involving semiconductor materials such as monocrystalline silicon and GaAs, some new manufacturing and processing techniques have emerged. For example, after thinning single crystal silicon from 720 μm to 200 μm or 150 μm, about 3-5 mm of material at the edge of the wafer needs to be removed. In addition, a blue film needs to be pasted on the front of the wafer to protect the circuit on the surface of the wafer. The blue film is a kind of high molecular polymer material, which has good light absorption performance in the ultraviolet band, and its thickness is about 150 μm. Therefore, the thickness of the material to be removed is generally around 300 μm-350 μm. The traditional removal method is cutting with a blade, spe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/04B23K26/06B23K26/08B23K26/38B23K26/046B23K26/36B23K26/70
Inventor 高云峰卢建刚杨欣荣
Owner HANS LASER TECH IND GRP CO LTD