Silicon-based double hetero-junction visible blind ultraviolet detector and manufacturing method thereof
An ultraviolet detector, double heterojunction technology, applied in sustainable manufacturing/processing, final product manufacturing, semiconductor devices, etc., can solve problems such as inability to detect ultraviolet light
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Embodiment 1
[0027] Example 1 as figure 2 As shown, the present invention provides a kind of n-ZnO / i-MgO / p-Si visible-blind ultraviolet detector, and its device structure comprises:
[0028] Si substrate 1, the Si substrate 1 is a p-type Si material, and its carrier concentration is 1×10 18-3 ;
[0029] MgO insulating layer 2, the thickness of the MgO insulating layer 2 is 50nm;
[0030] n-ZnO layer 3, the carrier concentration of the n-ZnO layer 3 is 4×10 16 cm -3 , whose thickness is 400nm;
[0031] n-type ohmic contact electrode 4, the electrode 4 is a Ti (20nm) / Au (40nm) metal electrode, and the metal Ti in the electrode 4 is in ohmic contact with the n-ZnO layer;
[0032] The p-type ohmic contact electrode 5 is an In metal electrode with a thickness of 0.1 mm.
[0033] The present invention can use radio frequency plasma-assisted molecular beam epitaxy equipment to realize the preparation of n-ZnO / i-MgO / p-Si heterojunction visible-blind ultraviolet photodetectors, and the specifi...
Embodiment 2
[0043] Example 2 as figure 2 As shown, the present invention provides a n-Mg 0.1 Zn 0.9 O / i-MgO / p-Si visible-blind UV detector, its device structure includes:
[0044] Si substrate 1, the Si substrate 1 is a p-type Si material, and its carrier concentration is 1×10 18 cm -3 ;
[0045] MgO insulating layer 2, the thickness of the MgO insulating layer 2 is 50nm;
[0046] n-Mg 0.1 Zn 0.9 O layer 3, the n-Mg 0.1 Zn 0.9 The carrier concentration of O layer 3 is 5×10 16 cm -3 , whose thickness is 300nm;
[0047] N-type ohmic contact electrode 4, this electrode 4 is Ti (20nm) / Au (40nm) metal electrode, metal Ti and n-Mg in this electrode 4 0.1 Zn 0.9 The O layer is an ohmic contact;
[0048] The p-type ohmic contact electrode 5 is an In metal electrode with a thickness of 0.1 mm.
[0049] The present invention can use radio frequency plasma assisted molecular beam epitaxy equipment to realize n-Mg 0.1 Zn 0.9 The preparation of O / i-MgO / p-Si heterojunction visible-bli...
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