Resin composition and multilayer structure body using the same

A technology of resin composition and multi-layer structure, which is applied in synthetic resin layered products, applications, household appliances, etc., can solve the problems of reduced barrier performance, poor appearance, voids, etc., and achieves excellent gas barrier properties and good resistance. pinhole effect

Inactive Publication Date: 2009-05-13
THE NIPPON SYNTHETIC CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when food, etc. are sealed in such packaging materials, when they are subjected to boiling sterilization, retort sterilization, etc., that is, when they are exposed to high temperature / high humidity, since EVOH is hydrophilic, a large amount of water will infiltrate. Voids and whitening occur on EVOH, which has the disadvantages of poor appearance or reduced barrier performance

Method used

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  • Resin composition and multilayer structure body using the same
  • Resin composition and multilayer structure body using the same
  • Resin composition and multilayer structure body using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0116] The EVOH composition (A1) obtained above and end-blocked nylon (B) [terminal carboxyl group content 20 μeq / g, terminal amino content 26 μeq / g] were supplied to a 30mmФ twin-screw extruder at a compounding weight ratio of 85:15 , melted and mixed at 240° C. to obtain pellets of the target resin composition.

[0117] The pellets (resin composition) (a) obtained above, nylon-6 ["NOVAMID 1022-1" manufactured by Mitsubishi Engineering Plastics Corporation] (b), polypropylene ["FL6CK" manufactured by Japan Poly Chem Corporation] (c) and Adhesive resin [Mitsui Chemicals "ADMER QFS00", maleic anhydride-modified polypropylene] (d) was supplied to a feed block type co-extrusion multilayer film forming machine (manufactured by GUNZE Sangyo Co., Ltd.), and formed into a A laminate (multilayer film) of a layer structure of (b) / (a) / (d) / (c)=20 / 20 / 10 / 80 (μm; thickness).

[0118] The obtained laminate was evaluated as follows regarding appearance, gas barrier properties, and pinhole re...

Embodiment 2

[0129] Except having used the EVOH composition (A2) instead of the EVOH composition (A1) in Example 1, the resin composition was produced similarly, and the same evaluation was performed.

Embodiment 3

[0131]Except having used the EVOH composition (A3) instead of the EVOH composition (A1) in Example 1, the resin composition was produced similarly, and the same evaluation was performed.

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Abstract

A resin composition that excels in high-temperature retort resistance and gas barrier and further excels in pinhole prevention after retort; and a multilayer structure making use of the same. There is provided a resin composition comprising ethylene / vinyl alcohol copolymer (A) and polyamide resin (B), characterized in that the ethylene / vinyl alcohol copolymer (A) is an ethylene / vinyl alcohol copolymer containing the following structural unit (1), preferably one obtained by copolymerization of 3,4-diacetoxy-1-butene, a vinyl ester monomer and ethylene and saponifying the resultant copolymer. Further, there is provided a multilayer structure having a layer comprising the above resin composition. (1) wherein X is any bonding chain excluding ether bonds; each of R1 to R4 independently is an arbitrary substituent; and n is 0 or 1.

Description

technical field [0001] The present invention relates to a resin composition containing a novel ethylene-vinyl alcohol copolymer (A) and a polyamide resin (B), and a multilayer structure using the resin composition, and more specifically, relates to high-temperature retort resistance , a resin composition and a multilayer structure excellent in gas barrier properties and pinhole resistance after retort. Background technique [0002] Generally, ethylene-vinyl alcohol copolymers (hereinafter referred to as EVOH) are excellent in transparency, gas barrier properties, fragrance retention, solvent resistance, oil resistance, etc., and can be used for food packaging materials and pharmaceuticals. Various packaging materials such as packaging materials, industrial pharmaceutical packaging materials, and pesticide packaging materials. However, when food, etc. are sealed in such packaging materials, when they are subjected to boiling sterilization, retort sterilization, etc., that is...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L23/08B32B27/30B32B27/32B32B27/34C08L29/04C08L77/00
CPCB32B27/34B32B27/30C08L23/0861C08L29/04C08L77/06B32B27/32C08L77/00B32B27/08B32B27/306B32B2439/70B32B2439/80
Inventor 古川和也守山隆雅井上馨
Owner THE NIPPON SYNTHETIC CHEM IND CO LTD
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