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Method for preparing circuit board guide hole

A manufacturing method and circuit board technology, applied in the direction of electrical connection formation of printed components, etc., can solve the problem of uniformity, poor flexibility of electroplating thin copper layer, conductivity and uniformity of copper layer on hole wall, and reduce the flexibility of copper clad laminate. Circuit quality and other issues, to achieve good electrical conductivity, avoid complete passivation, and dense structure

Inactive Publication Date: 2011-06-08
AVARY HLDG (SHENZHEN) CO LTD +1
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AI Technical Summary

Problems solved by technology

[0005] The manufacturing method of the above-mentioned guide hole has the following disadvantages: first, the manufacture of the guide hole requires more processes and is relatively complicated; second, an electroless copper plating layer and an electroplated thin copper layer are formed on the surface of the copper foil of the copper clad laminate , due to the poor uniformity and flexibility of the electroplated thin copper layer, the flexibility of the copper clad laminate and the quality of the subsequent circuit are reduced; thirdly, the hole wall copper layer includes the chemical copper layer, the electroplated thin copper layer and Thick copper layer is electroplated, the structure, performance difference and combination of each copper layer will affect the conductivity and uniformity of the copper layer on the hole wall

Method used

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  • Method for preparing circuit board guide hole
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  • Method for preparing circuit board guide hole

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Embodiment Construction

[0018] The manufacturing method of the circuit board guide hole provided by the technical solution will be further described in detail below in conjunction with the accompanying drawings and embodiments.

[0019] see figure 1 The manufacturing method of the circuit board guide hole provided in the embodiment of the technical solution comprises the following steps:

[0020] In the first step, a copper clad substrate 10 having at least one via hole 101 is provided.

[0021] The copper-clad substrate 10 includes at least two surface copper layers and at least one resin layer, which can be a double-sided copper-clad substrate, or a multi-layer substrate that has completed internal circuit production but has not yet undergone surface circuit production. see figure 2 , in this embodiment, the copper-clad substrate 10 is a double-sided copper-clad substrate, which includes a first copper layer 11, a second copper layer 12, and a resin layer 13 between the first copper layer 11 and...

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Abstract

The invention provides a circuit board conducting hole making method comprising the following steps: providing at least one through hole copper covered basis material; performing a chemical coppering process to form a chemical copper layer on the wall of the through, thereby making the through hole into conducting hole. The circuit board conducting hole making process in the technical scheme is simple.

Description

technical field [0001] The invention relates to circuit board manufacturing technology, in particular to a method for manufacturing a circuit board guide hole. Background technique [0002] With the development of electronic products in the direction of miniaturization and high speed, circuit boards are also developing from single-sided circuit boards and double-sided circuit boards to multi-layer circuit boards. Multilayer circuit boards refer to circuit boards with multiple layers of conductive circuits, which are widely used due to their large wiring area and high assembly density. Please refer to Takahashi, A. et al. published in IEEETrans in 1992. on Components, Packaging, and Manufacturing Technology's document High density multilayer printed circuit board for HITAC M-880. [0003] The conductive lines of each layer of the multilayer circuit board are electrically connected through the guide holes. The guide hole refers to a via hole with a conductive copper-plated l...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/42
Inventor 魏立国黄斯民涂致逸
Owner AVARY HLDG (SHENZHEN) CO LTD
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