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High silica/aluminum-based alloy and preparation method thereof

A technology of high-silicon-aluminum-based alloys, applied in the field of high-silicon-aluminum-based alloys and their preparation, can solve the problems of small and neglected thermal expansion coefficients, and achieve the effect of good electrical conductivity

Inactive Publication Date: 2010-12-29
TONGJI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Moreover, domestic scientific research institutions currently only emphasize the advantages of using high-silicon aluminum alloys in electronic packaging materials such as small thermal expansion coefficient and friction resistance, but ignore how to improve the conductivity of high-silicon aluminum alloys to meet the conductivity of industrial wires. make it for transmission lines

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Pure Al and Si with a purity of not less than 99.5% are made into raw materials according to the required atomic percentage, and mixed rare earths with a Ce element content of 45% are prepared according to the required atomic percentage, and are produced in a vacuum induction melting furnace Prefabricated alloy Al-20Si-0.35Re; put the prefabricated alloy Al-20Si-0.35Re into a vacuum melting furnace, atomize and spray powder under the protection of argon-nitrogen, the melting temperature is 1000°C, and the protective pressure is 0.8MPa; Put the atomized alloy Al-20Si-0.35Re powder into a high-energy planetary ball mill with a ball-to-material ratio of 10:1, a ball milling speed of 700r / min, and a ball milling time of 6 hours, using alcohol protection for ball milling. A small amount of epoxy resin is added to the obtained powder with a particle size of about 10 μm to make the powder bond very tightly and increase the sintered density of the product. At a temperature of 3...

Embodiment 2

[0029] The technical solution is as in Example 1, and a high-silicon-aluminum-based alloy whose composition is Al-20Si-0.35Re is prepared. In this scheme, the milling time is 12 hours instead of 6 hours, and the pressure is 350MP instead of 300MP. A cuboid aluminum-based alloy with a length of 80 mm, a width of 40 mm and a thickness of 3 mm was prepared using the technical solution described in Example 1. The glass transition temperature (Tg) of the alloy is 795K, and the electrical conductivity of the alloy is measured by a bridge resistance meter, and the results are shown in the table below.

Embodiment 3

[0031] The technical solution is as in Example 1, and a high-silicon-aluminum-based alloy whose composition is Al-20Si-0.35Re is prepared. In this scheme, the milling time is 18h instead of 6h, and the pressure is 400MP instead of 300MP. A cuboid aluminum-based alloy with a length of 80 mm, a width of 40 mm, and a thickness of 3 mm was prepared using the technical solution described in Example 1. The electrical conductivity of the alloy was measured by a bridge-type resistance meter, and the results are shown in the table below.

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Abstract

The invention discloses a high silicon-aluminum based alloy and a preparation method thereof. The preparation comprises the following steps: a, pure Al, Si, M alloys are smelted to obtain the prealloy of Al-aSi-bM, wherein M is selected from rare earth, Nb, Fe, Cu, Zr, Ti, V or Cr, a is not smaller than 5 and not larger than 60, b is not smaller than 0.1 and not larger than 10; b, the obtained prealloy of Al-aSi-bM is arranged in a vacuum induction smelting furnace; upon completion of the smelting, molten aluminum alloy is atomized to metallic powders by using nitrogen-argon mixed gas shield;c, the obtained metallic powders are arranged in a ball mill for ball-milling by argon shield; d, a bonding agent is doped in the powders obtained in the step c; e, the powders are arranged in a heatextruder for extrusion forming; f, the alloy obtained in the step e is coldrolled for several times. By applying the method in the invention, procedures and costs are remarkably simplified and lowered while acquiring the high silicon-aluminum based alloy with excellent high electric conductivity, thereby being favorable for batch production and application popularization.

Description

technical field [0001] The invention relates to an alloy, in particular to a high-silicon-aluminum-based alloy and a preparation method thereof. Background technique [0002] For a long time, copper and copper alloys have been regarded as the first choice for manufacturing conductive materials because of their excellent electrical conductivity. However, with the sharp reduction and depletion of global copper resources, the transaction price of copper has begun to rise rapidly. According to the latest data, the current trading price of copper per ton reaches about 7,000 US dollars. Such a high investment cost has caused the price of copper wires and other products to rise, making the world's power workers clearly aware of improving or looking for a new power transmission The importance and urgency of the line. Moreover, the soaring copper price has also caused many large and medium-sized manufacturing and processing enterprises at home and abroad to start looking for substit...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22D23/00C22C1/04B22F3/20
Inventor 严彪安建军董鹏程光
Owner TONGJI UNIV