Method for cleaning sapphire substrate

A sapphire substrate and ultrasonic cleaning technology, applied in the field of cleaning, can solve problems such as affecting cleaning efficiency, long cleaning time, and personnel poisoning, and achieve the effects of improving cleaning efficiency, convenient operation, and avoiding personnel poisoning

Inactive Publication Date: 2009-07-01
深圳市方大国科光电技术有限公司
View PDF0 Cites 17 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the traditional sapphire substrate cleaning method, toxic trichlorethylene is used for cleaning, which will not only cause personnel poisoning, but also pollute the environment; and because the

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0015] The third-generation semiconductor materials represented by GaN have made up for the inherent shortcomings of traditional semiconductor materials in terms of both optical and electrical properties, so they have developed extremely rapidly in recent years.

[0016] The cleaning method of the sapphire substrate of the present invention refers to the cleaning of the back-stage process, that is, the cleaning after grinding.

[0017] In the cleaning method of the sapphire substrate of the present invention, at normal room temperature, use isopropanol organic solvent and acetone organic solvent to clean under the cooperation of ultrasonic waves. In practice, the cleaning sequence of ultrasonic cleaning with isopropanol and ultrasonic cleaning with acetone can be changed. After the ultrasonic cleaning is completed, the sapphire substrate is soaked in an organic solvent of acetone under heating conditions for further processing.

[0018] In a preferred embodiment, in the sapph...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to a method for cleaning a sapphire substrate, which comprises a step of organic solvent ultrasonic cleaning at normal temperature; and a step of soaking by acetone when heated. Through the implementation of the method for cleaning the sapphire substrate, a trichloroethylene reagent used in the prior cleaning method is removed, so environmental pollution is reduced and operators are prevented from being poisoned; and during cleaning, the ultrasonic cleaning and the heating cleaning are used to save time and improve the cleaning efficiency and the cleaning quality. The method has the advantages of simple technology and convenient operation, and meets the requirement of environmental protection.

Description

technical field [0001] The present invention relates to cleaning method, more specifically, relates to a kind of sapphire substrate cleaning method. Background technique [0002] For the production of LED chips, the selection of substrate materials is the primary consideration. Which kind of suitable substrate should be used needs to be selected according to the requirements of equipment and LED devices. At present, sapphire substrates are generally used in the market. Typically, epitaxial layers of GaN-based materials and devices are mainly grown on sapphire substrates. Sapphire substrates have many advantages: First, the production technology of sapphire substrates is mature and the device quality is good; second, sapphire has good stability and can be used in high temperature growth process; finally, sapphire has high mechanical strength and is easy to handle and cleaning. Therefore, most processes generally use sapphire as a substrate. In the traditional sapphire su...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B08B3/12B08B3/08B08B3/10C11D7/26
Inventor 谢雄略
Owner 深圳市方大国科光电技术有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products