Method for producing electronic grade amorphous silicon powder

Abstract

The invention relates to a method for producing an electronic grade undefined silicon powder. Fused silica is selected to be raw material, fused quartz sand formed by pulverizing the fused silica by an iron-free pulverizer is processed by the operation of initial mulling by a globe mill and then is led into an initial grader to separate finer powder to be led into a vibromill, pulverized powder is led into a high-efficiency grader, ultra-fine powder in the form of smaller particles are led into a dust collector by the straight line wind power, and the ultra-fine powder led into the dust collector is led into a stirring mill to adjust the uniformity of the particle size of the ultra-fine powder, thereby enhancing the stable particle size of the adjusted powder; and after the operation of stirring is completed, the finished product of the powder is led into a packaging bag through a discharge hole, thereby forming quality products. After the fused quartz is repeatedly mulled by various types of mullers, the outline of the powder particle forms an obtuse angle, and the particle size distribution of the powder with reasonably matched outlines endues the standard products with considerably excellent flow property, thereby favorably avoiding the phenomenon of incomplete sealing occurring in a sealing and packing process; an added resin infill system has an effect of stronger strengthening action on filling bodies; and the defective index in the sealing and packing process is reduced.

Description

technical field [0001] The invention relates to a quartz product, in particular to a method for producing electronic grade amorphous 5-6 micron (2000 mesh) silicon micropowder. Background technique [0002] The existing production technology is to use an iron hammer to crush the fused silica, use the crushed fused silica sand as a raw material and add it to a ball mill for grinding, and use a mechanical sieving machine to roughly classify the ground semi-finished product to obtain amorphous silicon micropowder. [0003] Its disadvantages: 1. Crushing fused silica with an iron hammer will cause serious pollution to the crushed fused silica sand. Since the hardness of quartz is higher than that of iron during the crushing process, a considerable amount of iron powder will be produced during the crushing process and enter the melting process. In the quartz sand, and eventually enter the finished product along with the production process, the iron content in such amorphous silic...

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Problems solved by technology

[0003] Its disadvantages: 1. Crushing fused silica with an iron hammer will cause serious pollution to the crushed fused silica sand. Since the hardness of quartz is higher than that of iron during the crushing process, a considerable amount of iron powder will be produced during the crushing process and enter the melting process. In the quartz sand, and finally enter the finished product along with the production process, the iron content in such amorphous silicon micropowder is easy to exceed the standard, and the electrical performance of the package will be poor after being added to the packaging material system, which will affect the service life of the integrated circuit

2. The force acting on the material when the ball mill is grinding is mainly the impact force generated when the grinding medium falls. Such repeated vertical impacts cause the particle shape of the material to bear sharp water chestnuts, flakes and needles during the crushing process. Such The particle shape is very easy to cause damage to the gold wire during the circuit packaging process, and at the same time reduces the flow performance of the packaging material, making the package prone to unsatisfactory sealing

3. The traditional mechanical screening process has great limitations. The screening products are usually coarse products with a size of 600 mesh or more, and because it only blindly pursues the pass rate of large particles in the product classification process, it is impossible to control the particle size distribution of the product. In this way, only products with single particle size, coarse particles, poor stability, and narrow distribution can be obtained. Such products entering the electronic packaging line will directly affect the fluidity of the packaging material, the compactness of the package, and the filling ratio of the filler. parameter