System and method for polishing surface of tape-like metal base material

一种金属基材、带状的技术，应用在研磨装置、研磨机床、金属加工设备等方向，能够解决氧化物超传导体临界电流密度低等问题

Inactive Publication Date: 2009-07-15
NIHON MICRO COATING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0012] One of the problems is that the critical current density of oxide superconductors is low

Method used

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  • System and method for polishing surface of tape-like metal base material
  • System and method for polishing surface of tape-like metal base material
  • System and method for polishing surface of tape-like metal base material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0110] Instructions for use figure 1 With the grinding system of the present invention shown, experiments were performed to grind a strip-shaped metal substrate.

[0111] 1. Experimental conditions

[0112] (1) Strip metal substrate: nickel alloy (Ni: 58.0wt%, Cr: 15.5wt%, Fe: 5.0wt%, W: 4.0wt%, also contains Co, etc.) width 10mm, length 100m, thickness 0.1mm

[0113] (2) The first polishing step: a tape body with a width of 150 mm and a thickness of 500 μm formed by foaming polyurethane on a PET film was used as the polishing tape

[0114] Rotational speed of the grinding head (rpm): 30~80 for the first stage, 30~80 for the second stage

[0115] Direction of rotation: 1st stage clockwise, 2nd stage counterclockwise

[0116] Pressure (g / cm 2 ): Level 1 100~500, Level 2 100~500

[0117] Slurry flow rate (ml / min): 5~30 for the first stage, 5~30 for the second stage

[0118] (3) The second grinding process: use non-woven fabric made of polyester fiber as the liner used for ...

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Abstract

Provided are a system and a method for uniformly polishing a surface of a tape-like metal base material in a unit of several hundred meters, at a high speed and a high efficiency. The polishing system for continuously polishing the surface of the tape-like metal base material to be polished is provided with an apparatus for continuously running the tape-like metal base material; an apparatus for applying a prescribed tension to the tape-like metal base material; a first polishing apparatus for performing initial polishing at random to the surface of the tape-like metal base material to be polished; and a second polishing apparatus for performing final polishing to the surface of the tape-like metal base material to be polished, along the running direction. A polishing mark is formed by the final polishing, along the running direction on the surface to be polished.

Description

technical field [0001] The invention relates to a device and method for grinding a strip-shaped metal substrate to a predetermined surface roughness. In particular, it relates to a surface polishing system and polishing method for a strip-shaped metal used as a substrate for forming a functional thin film exhibiting superconducting, ferroelectric, and ferromagnetic properties. Background technique [0002] Surface treatment of substrate materials is an important issue in products that form functional thin films on metal strip-shaped substrates and use them. [0003] Generally, a strip-shaped metal substrate is processed into a strip shape by cold rolling or hot rolling. However, this processing is due to the existence of scratches and crystal defects formed by rolling, so unless these are removed, the intended functional film properties cannot be obtained. [0004] Therefore, a method of removing scratches or crystal defects by grinding the surface while making the surface...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B7/13B24B37/04
CPCB24B7/13B24B37/04
Inventor 渡边武洋堀本真树永峯拓也堀江祐二
Owner NIHON MICRO COATING
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