Adhesive composition used for non-halogen coating and coating using the same
A technology of adhesives and compositions, which is applied in the field of adhesive compositions for halogen-free cover films and adhesive compositions for halogen-free cover films, and can solve problems such as non-compliance with performance requirements and unfavorable environments
Active Publication Date: 2012-06-13
TORAY ADVANCED MATERIALS KOREA
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Problems solved by technology
[0005] Conventional adhesives for cover films are generally based on epoxies, acrylics, phenolic resins, polyesters, etc., but all of these use halogen-based flame retardants such as bromine, which is not good for the environment
Halogen-based flame retardants are to be avoided for environmental reasons, so cover films using halogen-free flame retardants have been developed, but they do not meet all of the above physical property requirements
Method used
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Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1
[0048] Components (30% solids) having parts by weight described in Table 1 below were uniformly mixed and dispersed into the methyl ethyl ketone solvent with a homogenizer.
[0049] The mixture was then applied to a polyimide film with a thickness of 12.5 μm so that the thickness of the dried coating was 25 μm, and then the coated films were thermally cured in a 50°C oven for 10 minutes, followed by an oven at 60°C Cure on medium heat for approximately 3 minutes. The resulting dried film was laminated with a separator to prepare a cover film.
Embodiment 2-14
[0051] Cover films were prepared in the same manner as in Example 1, except that the adhesive components of Examples 2 to 14 in Table 1 below were mixed, respectively.
[0052] Table 1: Components (by weight) of each embodiment
[0053] NBR
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Abstract
The invention relates to an adhesive composite for halogen free covering films, which is used for preparing covering films for protecting flexible printed circuit board, and further relates to covering films comprising such adhesive composite. Move specially, the invention relates to an adhesive composite for halogen free covering films and covering films using the same which meets all requirements in fire resistance, binding property, heat resistance, permeability, and fluidity. To this end, the adhesive composite of the halogen free covering film is characterized in comprising (1) a nitrilebutadiene rubber (NBR) including carboxyl with molecular weight from 10,000 to 200,000 and having 20 to 40 weight parts of acrylonitrile content, (2) a non-halogen multifunctional epoxide resin with two or more epoxide group on each molecule thereof and having molecular weight from 200 to 1,000, (3) a hardening agent, (4) a curing accelerant, (5) a non-halogen phosphorus fire resistor with content of phosphorus fire resistor larger than 10% by weight and thermal cracking temperature higher than 300 DEG C., and (6) inorganic particles, such as aluminum hydroxide, magnesium hydroxide, zinc oxide, magnesium oxide, antimony trioxide, silica or the like.
Description
technical field [0001] The present invention relates to an adhesive composition for a halogen-free cover film for protecting a flexible printed circuit board, and to a cover film using the adhesive composition. More specifically, the present invention relates to an adhesive composition for a halogen-free cover film that meets all requirements for flame retardancy, adhesiveness, heat resistance, exudation, fluidity, etc., and relates to the use of A cover film of the adhesive composition. Background technique [0002] Recently, flexible printed electrode plates have been significantly and increasingly used in compact, thin and highly integrated consumer electronics. Therefore, cover films are also increasingly used to protect circuits, and thus improvements in adhesiveness, heat resistance, flame retardancy, fluidity, and the like are indeed required. [0003] Moreover, in Europe, WEEE and RoHS, etc. require the development of environmentally friendly materials. However, a...
Claims
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IPC IPC(8): C09J109/02C09J163/00C09J11/06C08J5/12
CPCC08K5/5313C09J7/25C09J9/00C09J11/04C09J11/06C09J109/00C09J163/00C09J2203/00C09J2301/408C09J2479/086
Inventor 金佑锡全海尚文基祯金志赫金度均
Owner TORAY ADVANCED MATERIALS KOREA