Copper linking wire and production method thereof

Abstract

The invention discloses a copper bonding wire and the weight percentages of components in the copper bonding wire are as follows: La accounts for 0.0008 to 0.002 wt percent, Ce accounts for 0.001 to 0.003 wt percent, Ca accounts for 0.002 to 0.004 wt percent, and Cu accounts for 99.99 to 99.995 percent. The copper bonding wire has low trajectory, low hardness and good oxidation resistance and avoids the oxidation of the copper bonding wire at normal temperature, so the copper wire can be stored for a long term at normal temperature, and the method can also meet the demand of high performance, multifunction, miniaturization and portable development of electronic packaging.

Description

technical field [0001] The invention belongs to the technical field of semiconductor materials, and mainly relates to a copper bonding wire with low radian, low hardness and good oxidation resistance. Background technique [0002] Compared with gold wire and aluminum wire, copper bonding wire has excellent mechanical properties, electrical properties, thermal properties and low growth of intermetallic compounds, which greatly improves chip frequency and reliability, and adapts to low-cost, fine-grained The development of spacing and high lead-out component packaging. The transition from aluminum metallization to copper metallization on wafers makes for new packaging designs for high-speed devices, choosing short copper wire bonding and copper pads with a pitch of less than 50 μm will become a strong competition for flip-chip soldering processes in the packaging market opponent. And through the improvement of the new process, the copper wire bonding is stronger and more sta...

AI Technical Summary

Problems solved by technology

But for copper bonding wire, due to its high hardness, it is easy to cause substrate damage in large scale integrated circuit packaging

Compared with bonding gold wire, copper bonding wire has lively chemical properties and is easier to oxidize, which reduces the reliability of electronic components.