Gold bonding wire and preparation method thereof

Abstract

The invention provides a gold bonding wire. The gold bonding wire comprises the following materials in percentage by weight: 0.0005 to 0.001 percent of beryllium, 0.0008 to 0.002 percent of copper or germanium, 0.001 to 0.003 percent of cerium and the balance of gold, wherein the purity of the gold is more than or equal to 99.996 weight percent. The invention also provides a preparation method ofthe gold bonding wire. The preparation method comprises the following steps of: electrorefining high-purity gold with purity of 99.999 weight percent by using gold with purity of 99.99 weight percent; smelting the high-purity gold; performing ingot casting to form a gold plate; rolling the gold plate to be a thin gold sheet; manufacturing an intermediate alloy; performing vertical smelting; drawing the wire; annealing; winding; and performing vacuum packaging. The gold bonding wire has the characteristics of high strength and low long radian, the yield of products is high, and the winding length of a reeling shaft is large.

Description

technical field [0001] The invention relates to the field of bonding wires, in particular to a bonding gold wire and a preparation method thereof. Background technique [0002] Bonding gold wire is the key lead material for the connection of integrated circuit or transistor chip die and lead frame. In recent years, with the rapid development of the semiconductor industry, the integration of integrated circuits is getting higher and higher, the thickness of the circuit board is getting smaller and smaller, the number of electrodes on the device is increasing, the distance between the electrodes is getting narrower, and the packaging density is also corresponding It is becoming smaller and smaller, and the objective requirement is that the bonding gold wire used as the lead wire has high strength, low long arc and very high arc stability. At present, the bonding gold wire mainly uses elements such as beryllium, cerium, and silver as the trace elements of the alloy. These trac...

AI Technical Summary

Problems solved by technology

At present, the bonding gold wire mainly uses elements such as beryllium, cerium, and silver as the trace elements of the alloy. These trace elements can refine the grain and strengthen the gold. High demands on long arcs

[0003] However, in the preparation process of the existing bonded gold wires, it is generally necessary to heat them to 300-600°C for annealing. After annealing, they are directly wound on the take-up shaft for coiling. Due to the knot effect, the thread cannot be released when the next process is used, resulting in a large number of broken threads, and the product yield is not high, so the winding length of the take-up shaft is limited.

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