Circuit parameter demarcating method for photodetector for direct coupling and apparatus thereof

Abstract

The embodiment of the invention discloses a method for calibrating the circuit parameters of an optical detector applied to direct coupling. The method includes the following steps: a tube core of the optical detector is sheathed and connected in a temporary encapsulation shell; after receiving optical information through the temporary encapsulation shell, the tube core of the optical detector calibrates the circuit parameters under analog light attenuation; after the calibration of the circuit parameters is completed, the tube core of the optical detector is removed from the temporary encapsulation shell. Correspondingly, the embodiment of the invention also discloses the temporary encapsulation shell. Through the implementation of the embodiment, the tube core of the optical detector issheathed and connected in the temporary encapsulation shell, and then is removed from the temporary encapsulation shell after the calibration of various circuit parameters is completed to facilitate the final direct coupling, thus realizing the calibration of various circuit parameters in an analog light attenuation way in the process of producing direct coupling products, improving the calibration efficiency of circuit parameters and leading to more convenient and accurate calibration of circuit parameters.

Description

technical field [0001] The invention relates to the communication field, in particular to a method for calibrating the circuit parameters of a directly coupled photodetector and a temporary packaging shell. Background technique [0002] Free Space Optical Communication (FSO, Free Space Optical Communication) often adopts direct coupling to receive the space optical path, that is, the receiving lens directly converges the received light into the photodetector. At present, the packaged photodetector die produced by the photodetector manufacturer is fixed in the housing by non-recoverable fixing methods such as glue or welding, so as to avoid the photodetector die from being subjected to mechanical stress. destroys the internal structure, and can facilitate the calibration of various circuit parameters. However, the packaged photodetector core is generally designed for a certain physical interface for connecting optical fibers. When direct coupling is performed, the package she...

AI Technical Summary

Problems solved by technology

At present, the packaged photodetector die produced by the photodetector manufacturer is fixed in the housing by non-recoverable fixing methods such as glue or welding, so as to avoid the photodetector die from being subjected to mechanical stress. destroys the internal structure, and can facilitate the calibration of various circuit parameters. However, the packaged photodetector core is generally designed for a certain physical interface for connecting optical fibers. When performing direct coupling, the package shell The body tends to block the optical path of the direct coupling, which seriously affects the direct coupling

Images