Silicon micro mechanical pressure switch, preparation method and use thereof
A pressure switch, silicon micro-machine technology, applied in the field of micro-mechanical pressure switches based on MEMS technology, can solve problems such as unoptimistic application scope and application prospects, increased fuel consumption, price factors and limited effects
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[0032] The specific structure of the pressure switch will be explained in detail below in combination with the technological process provided by the present invention.
[0033] (1) On the polished single crystal silicon wafer 1, thermal silicon oxide is formed by high temperature oxidation, and the thickness of the oxide layer is 0.5 micron, which is used as a mask for wet etching. The pattern of the photolithographic throttle groove, using the photoresist as a mask, first use dilute hydrofluoric acid (NH 4F: HF = 7: 1) Etch silicon oxide, then remove glue, use silicon oxide as a mask, use KOH to etch monocrystalline silicon in a wet method, and form at least one throttling groove, the length of the throttling groove is 900-1000 microns, The width is 2-5 μm, and the depth is 1-2 μm. See diagram 2-1 .
[0034] (2) On the polished single-crystal silicon wafer 1 on which the throttling groove is formed in step 1, thermal silicon oxide is formed by high-temperature oxidation, ...
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