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Silicon micro mechanical pressure switch, preparation method and use thereof

A pressure switch, silicon micro-machine technology, applied in the field of micro-mechanical pressure switches based on MEMS technology, can solve problems such as unoptimistic application scope and application prospects, increased fuel consumption, price factors and limited effects

Inactive Publication Date: 2009-08-19
SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Neither TPMS nor PRX technology involves active protection and relief after a car blowout, and PRX products are very limited due to price factors and functions, especially when the tire section height is reduced, the stiffness increases, and the wheel adhesion decreases, so the tire width must be increased, resulting in rolling resistance. Fuel consumption is increased due to the increase, and the reduction of the tire section greatly reduces the shock absorption performance of the tire, which reduces the comfort performance of the car, and the application range and application prospects are not optimistic.

Method used

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  • Silicon micro mechanical pressure switch, preparation method and use thereof
  • Silicon micro mechanical pressure switch, preparation method and use thereof
  • Silicon micro mechanical pressure switch, preparation method and use thereof

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Embodiment Construction

[0032] The specific structure of the pressure switch will be explained in detail below in combination with the technological process provided by the present invention.

[0033] (1) On the polished single crystal silicon wafer 1, thermal silicon oxide is formed by high temperature oxidation, and the thickness of the oxide layer is 0.5 micron, which is used as a mask for wet etching. The pattern of the photolithographic throttle groove, using the photoresist as a mask, first use dilute hydrofluoric acid (NH 4F: HF = 7: 1) Etch silicon oxide, then remove glue, use silicon oxide as a mask, use KOH to etch monocrystalline silicon in a wet method, and form at least one throttling groove, the length of the throttling groove is 900-1000 microns, The width is 2-5 μm, and the depth is 1-2 μm. See diagram 2-1 .

[0034] (2) On the polished single-crystal silicon wafer 1 on which the throttling groove is formed in step 1, thermal silicon oxide is formed by high-temperature oxidation, ...

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PUM

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Abstract

The invention relates to a silicon micromechanical pressure switch, a manufacturing method and application thereof, which is characterized in that an upper silicon-chip electrode and a lower silicon-chip electrode of the pressure switch are encapsulated in a metal tube shell, thus forming an air chamber; the upper electrode is isolated from the lower electrode by silicon dioxide serving as an insulation layer; a clearance is formed between the upper silicon-chip electrode and the lower silicon-chip electrode; the upper silicon-chip electrode comprises a silicon elastic thin film, at least one throttling groove, a gold thin film and a frame; the lower silicon electrode comprises a deflector hole and a gold thin film; the deflector hole right faces the center of the silicon elastic thin film which is positioned in the middle of the bottom of the upper silicon-chip electrode; the throttling groove is positioned between the clearance formed by the combination of the upper silicon-chip electrode and the lower silicon-chip electrode after bonding; the frame of the upper silicon-chip electrode is covered by silicon dioxide; the manufacturing method is based on the MEMS technology and comprises the steps of forming the throttling groove, forming the frame, forming the silicon elastic thin film, forming an electrical contact silicon film graph, forming an electrical contact gold film graph, forming the deflector hole, bonding the upper electrode and the lower electrode and encapsulating devices; and the silicon micromechanical pressure switch is mainly applied to fast braking of a tyre when the tyre bursts.

Description

technical field [0001] The invention relates to a silicon micromechanical pressure switch, a manufacturing method and its application, more precisely a micromechanical pressure switch based on MEMS (Micro Electro-Mechanical System) technology. When a tire blows out, the switch can quickly Closed, so as to turn on the circuit of the tire brake device, so that the tires can be braked quickly. It belongs to the field of microelectromechanical systems (MEMS). Background technique [0002] According to the statistics of the Ministry of Public Security, 70% of the traffic accidents on Chinese highways are caused by blown tires, while in the United States this ratio is as high as 80%. Representative devices currently used for tire blowout accidents are tire pressure monitoring systems (TPMS) and self-supporting tires (PRX). [0003] Tire Pressure Monitoring System (TPMS) is mainly used to monitor tire pressure in real time, and there are mainly two solutions (direct system and in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01H35/14H01H11/00B81B7/02B81C1/00
Inventor 熊斌荆二荣王跃林
Owner SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI