Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Conductive silver ink for encapsulating LED and preparation method thereof

A technology of conductive silver glue and formula, applied in conductive adhesives, chemical instruments and methods, circuits, etc., can solve the problems of long curing time, waste, complicated construction process, etc., and achieve simple preparation method, environmental protection, energy consumption low effect

Active Publication Date: 2009-08-26
宁波安芯美半导体有限公司
View PDF0 Cites 16 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

A large number of air bubbles are generated during the stirring process and cannot be eliminated, and the unused conductive silver glue will solidify by itself, resulting in waste
Moreover, the curing temperature of the current conductive silver glue is relatively high, and when the conductivity of the conductive silver glue is good, the thermal conductivity and adhesion are not good; and when the thermal conductivity and adhesion are good, the conductivity of the conductive silver glue is not good. Good, but generally speaking, the higher the curing temperature of conductive silver glue, the faster the curing speed, the higher the bonding strength and the better the conductivity, but the construction process is more complicated; if it can be cured at room temperature, the curing time is longer, Both bond strength and conductivity are affected

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0032] A preparation method of conductive silver glue for encapsulating LEDs, mainly comprising the following steps:

[0033] 1) Weighing 5-25% glue matrix and 10-15% solvent respectively according to the composition and weight ratio;

[0034] 2) Mix the weighed resin with the solvent, and use a high-speed mixer to evenly disperse the resin in the solvent;

[0035] 3) Weighing 0.5-12% of the curing agent by weight and adding it to the mixed system of the above resin and solvent, using ultrasonic waves for 10-30 minutes, and controlling the temperature between 20-25°C to obtain the mixed system;

[0036] 4) Weighing 40-85% ultra-fine silver powder by weight and adding it to the above mixing system, stirring and dispersing with a defoaming mixer, so that the ultra-fine silver powder is fully dispersed in the organic system to obtain a preliminary conductive silver glue;

[0037] 5) weighing 0.05-10% curing accelerator by weight percentage for subsequent use;

[0038] 6) Weigh ...

Embodiment 1

[0041] A conductive silver glue for encapsulating LEDs, mainly comprising the following steps:

[0042] 1) Take by weighing 5% resin and 13% solvent, 60% ultrafine silver powder; 8% curing agent; 9.5% curing accelerator; 4.5% auxiliary agent according to the composition and weight percentage;

[0043] 2) Mix the weighed resin and the solvent together, make the high-speed mixer stir for 15 minutes under the condition of 1200rpm, and evenly disperse the resin in the solvent;

[0044] 3) Weigh 8% curing agent HB-175 by weight percentage and add it to the mixed system of the above resin and solvent, perform ultrasonic treatment for 30 minutes, and control the temperature between 25°C to obtain the mixed system;

[0045] 4) 60% of the ultra-fine silver powder weighed by weight is added to the above mixing system, stirred and dispersed with a defoaming mixer for 10 minutes, so that the ultra-fine silver powder is fully dispersed in the organic system, and a preliminary conductive si...

Embodiment 2

[0050] A preparation method of conductive silver glue for encapsulating LEDs, mainly comprising the following steps:

[0051] 1) Take by weighing 10% glue base and 11% ethylene glycol diethyl ester solvent, 77% ultrafine silver powder; 0.5% curing agent; 1% curing accelerator; 0.5% Auxiliary;

[0052] 2) Mix the weighed resin and the solvent together, make the high-speed mixer stir for 15 minutes under the condition of 1200rpm, and evenly disperse the resin in the solvent;

[0053] 3) Weigh 0.5% curing agent SM-75L by weight percentage and add it to the mixed system of the above resin and solvent, perform ultrasonic treatment for 10 minutes, and control the temperature between 20°C to obtain the mixed system;

[0054] 4) 77% of the ultra-fine silver powder weighed by weight is added to the above mixing system, stirred and dispersed with a defoaming mixer for 15 minutes, so that the ultra-fine silver powder is fully dispersed in the organic system, and a preliminary conductive...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
particle sizeaaaaaaaaaa
purityaaaaaaaaaa
Login to View More

Abstract

The invention relates to LED encapsulation technology, and in particular relates to a conductive silver ink for encapsulating LED and preparation method thereof. The conductive silver ink comprises the following components of: ultrafine silver powder; an ink substrate; a solvent; a curing agent; a curing accelerator and an auxiliary agent. The manufacturing method of the conductive silver ink comprises the following steps of: 1) weighting the ink substrate, the solvent, the ultrafine silver powder, the curing agent, the curing accelerator and the auxiliary agent based on weight percentage; 2)mixing the weighted resin with the solvent, stirring at high speed and dispersing the resin in the solvent; 3) weighting the curing agent based on the weight percentage, adding the curing agent into a mixed system to be ultrasonically processed to obtain the mixed system; 4) adding the ultrafine silver powder into the mixed system for being stirred and dispersed so as to obtain preliminary conductive silver ink; 5) weighting the curing accelerator; 6) weighting the auxiliary agent; and 7) adding the well-weighted curing accelerator and the auxiliary agent into the well-prepared conductive silver adhesive, and rolling with a three-high mill to result in conductive silver ink products. The invention is simple in the preparation method, easy in operation, low in energy consumption and free from pollution.

Description

technical field [0001] The invention relates to LED packaging technology, in particular to a conductive adhesive for packaging LEDs and a preparation method thereof. Background technique [0002] Conductive adhesive, referred to as conductive adhesive, is an adhesive that can effectively bond various materials and has conductive properties. Conductive adhesive can be divided into two categories: structural type and filling type according to the composition of the matrix. The structural type refers to the conductive adhesive in which the polymer material itself is conductive as the matrix of the conductive adhesive; the filled type refers to the conductive adhesive that usually uses the adhesive as the matrix and relies on the addition of conductive fillers to make the glue conductive. At present, the preparation of conductive polymer materials is very complicated, and there is still a long way to go from practical application, so the widely used ones are filled conductive a...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/00C09J133/02C09J11/04C09J9/02C09K3/10H01L23/29
Inventor 张宇阳
Owner 宁波安芯美半导体有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com