Compositions and methods for resin-based wood glues
A composition and resin technology, applied in the direction of adhesives, inorganic adhesives, adhesive additives, etc., can solve the problems of adhesive properties such as loss of strength or solidification rate, and achieve the effect of easy transportation
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Embodiment 1
[0061] Example 1 - Extender Composition
[0062] Prepare the extender composition by mixing the following:
[0063] i) has a solids content of 45% in water and SiO 2 :Na 2 80% by weight sodium silicate solution with an O ratio of 2.22:1;
[0064] ii) 20% by weight crane sugar syrup with a sugar content of 76%.
[0065] The cane syrup is made from Brazilian Dulcini Invert sugar provided by Gludex 201.
[0066] The resulting composition is a homogeneous clear liquid at 25°C, suitable for delivery and use as an extender for resin-based adhesives.
[0067] Example 2 - Glue
[0068] The glue is formed by mixing the following:
[0069] i) 21.4% by weight phenolic resin solution (50% by weight phenol formaldehyde, 50% by weight water) supplied by BAQ Brazil as Baqphen 4051-3;
[0070] ii) 50% by weight of the extender composition of Example 1;
[0071] iii) 14.3% by weight of water;
[0072] iv) 14.3% by weight of wheat flour.
[0073] The resulting composition is as fo...
Embodiment 4
[0094] Example 4 - Extender Composition
[0095] Prepare the extender composition by mixing the following
[0096] i) has a solids content of 45% in water and SiO 2 :Na 2 A 90% by weight sodium silicate solution with an O ratio of 2.15:1;
[0097] ii) 10% by weight cane syrup with a sugar content of 76%.
[0098] The cane syrup is made from Brazilian Dulcini Invert sugar provided by Gludex 201.
[0099] The resulting composition is a homogeneous clear liquid at 25°C, suitable for delivery and use as an extender for resin-based adhesives.
Embodiment 5
[0100] Example 5 - Glue and Plywood
[0101] Glue 5A and 5B were prepared for two types of plywood. Glue 5A is a wood glue of the invention, while glue 5B is not a wood glue of the invention. The details of the two glues are given below:
[0102] Glue 5A (the present invention)
[0103] 57% phenolic resin solution (as detailed above, 50% by weight phenol formaldehyde resin, 50% by weight water);
[0104] 14.33% of the extender composition of Example 4;
[0105] 14.33% wheat flour;
[0106] 14.33% water.
[0107] This gives the resulting composition of 5A:
[0108] Phenolic resin 28.5%
[0109] Sodium silicate 5.80%
[0110] Sugar 1.09%
[0111] Wheat Flour 14.33%
[0112] Water + trace ingredients to 100%.
[0113] Glue 5B (comparative example)
[0114] 71.33% phenolic resin solution (as detailed above, 50% by weight phenol formaldehyde resin, 50% by weight water);
[0115] 14.33% wheat flour;
[0116] 14.33% water.
[0117] This gives the resulting composition ...
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