Method for forming solder performs on welding spots of a circuit substrate and flip-chip method
A circuit substrate and flip-chip packaging technology, which is applied in the formation of conductive patterns, circuits, printed circuits, etc., can solve the problems of affecting soldering quality, insufficient pre-solder, and inability to meet the accuracy of circuit substrates, and achieve the effect of improving manufacturing accuracy
Inactive Publication Date: 2009-09-02
AVARY HLDG (SHENZHEN) CO LTD +1
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Problems solved by technology
[0004] However, when a force is applied to the template to separate it from the circuit substrate, the metal material adhered to the through hole of the template is easily taken away by the template, especially for a circuit substrate with a small line pitch. There is less pre-solder, if the metal material is taken away by the template, the pre-solder at the solder joint will be seriously insufficient, which will affect the quality of subsequent soldering
In addition, the printing accuracy of the pre-solder forming method is between 20 microns and 25 microns, and only circuit boards with a line width greater than 0.3 mm can be produced
[0005] Therefore, the existing method for forming pre-solder on circuit boards cannot meet the requirements of the accuracy of circuit boards. It is necessary to provide a method for forming pre-solder on solder joints on circuit boards and a flip-chip packaging method to avoid insufficient solder and improve follow-up products. Yield
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[0012] The method for forming pre-solder on the solder joints of the circuit substrate and the flip-chip packaging method of the technical solution will be described in detail below with reference to the embodiments and accompanying drawings.
[0013] The flip-chip packaging method of the technical solution includes the steps of forming pre-solder on solder joints of the circuit substrate and using the pre-solder to package the circuit substrate and electronic components to be packaged such as chips.
[0014] Please also refer to Figure 1 to Figure 8 , the method for forming pre-solder at the solder joint of the circuit substrate can be carried out in the following steps:
[0015] In the first step, a circuit substrate 100 is provided.
[0016] see figure 2 and image 3 , the circuit substrate 100 provided in this embodiment has a first surface 110 and a second surface 120 opposite to the first surface 110 . Wherein, a plurality of conductive lines 111 and a plurality of...
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The invention relates to a method for forming solder performs on welding spots of a circuit substrate, which comprises the following steps: providing the circuit substrate, wherein a plurality of conductive circuits and welding spots are formed on at least one surface of the circuit substrate; jetting photo resist onto the surface of the circuit substrate to form a photo resist layer with a plurality of accommodating holes, and exposing corresponding welding spots out of each accommodating hole; filling a metal material in each accommodating hole; heating the metal material to form the solder performs; and removing the photo resist layer. The invention also relates to a flip-chip method. The method for forming the solder performs on the welding spots of the circuit substrate and the flip-chip method can improve precision and yield of products.
Description
technical field [0001] The invention relates to the technical field of circuit board welding, in particular to a method for forming pre-solder on solder joints of a circuit substrate and a flip-chip packaging method. Background technique [0002] As the carrier of various electronic components such as resistors, capacitors, and integrated circuit chips, circuit boards are widely used in various electronic products. Various electronic components are generally packaged on the surface of the circuit substrate by soldering. When soldering electronic components on the surface of the circuit substrate, it is usually necessary to form pre-solder on the solder joints on the surface of the circuit substrate, and then solder the electronic components to the surface of the circuit substrate through the pre-solder. See literature: PCB solder mask and flux compatibility; Slima, Timothy P; Wickem, Walter W; Young, Tim A; The Technical Program of the National Electronic Packaging and Prod...
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IPC IPC(8): H05K3/10H01L21/60
CPCH05K3/3484H05K2203/043H05K2203/0568H01L24/11H01L2924/14H01L2924/1461H05K3/3485Y10T29/49155H01L2924/00
Inventor 黄凤艳赖永伟刘兴泽
Owner AVARY HLDG (SHENZHEN) CO LTD