Curable cross-linked type ink composition and dielectric film

A technology of dielectric films and compositions, applied in inks, parts containing printed electrical components, fixed capacitors, etc., can solve the problem of poor heat resistance and chemical resistance of dielectric materials, making ultra-thin capacitors, To solve problems such as limited properties, to achieve the effects of good ink storage, good heat and chemical resistance, and good inkjet performance

Inactive Publication Date: 2009-09-09
IND TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In addition, US6905757 emphasizes the manufacturing method of the embedded capacitance layer of the printed circuit board. Although the content mentions the resin composition and the characteristics of the powder, there is no material formula that can be produced by spray printing in the specification.
[0009] The high dielectric material formulations mentioned in the above patents all have relatively high viscosity (>100cps) and relatively large filling powder particles (>500nm), and it is impossible to make ultra-thin capacitors by spray printing process. Printable and high dielectric material formulations are by no means easy to learn from the known organic-inorganic hybrid high dielectric material formulation technology
[0010] In the past, patents using jet printing technology to make dielectric films were only disclosed in US20050137281A1 by adding nano-BaTiO to ethylene copolymers containing cyano groups. 3 Dielectric ceramic powder to achieve the purpose of printing ink with high dielectric constant, but the dielectric material of this kind of pure ethylene copolymer system has poor heat resistance and chemical resistance, and its application will be limited

Method used

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  • Curable cross-linked type ink composition and dielectric film
  • Curable cross-linked type ink composition and dielectric film
  • Curable cross-linked type ink composition and dielectric film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0063]

[0064] 100 grams of BaTiO with an average particle size of about 100 nm 3 (Inframat Advanced Materials, BT-1), add 20 grams of high molecular weight dispersant BYK-9010 (supplied by BYK chemie, containing acid group copolymer dispersant A), and add 760 grams of grinding medium zirconium beads and 150 gram of ethyl lactate solvent, followed by wet grinding with a sand mill for 2 hours for dispersion treatment, and then filtering and separating the grinding beads to obtain a high dielectric powder dispersion.

[0065]

[0066] 10.50 grams of bisphenol-A diglcidyl ether (bisphenol-A diglcidyl ether) (188EL, Changchun resin company, Taiwan), 7.70 grams of tetrabromo bisphenol-A epoxy resin (tetrabromo disphenol-A diglcidylether) (BEB-350 , Changchun Company, Taiwan), 2.70 grams of cyclo aliphatic epoxy resin (cyclo aliphaticepoxy) (HP-7200, DIC, Japan), 3.70 grams of multifunctional epoxy resin (Multifunctional epoxy) (EPPON502H, Nippon Kayaku) system and 460 grams o...

Embodiment 2

[0070] The preparation procedure is the same as in Example 1, but the high dielectric powder is replaced by BaTiO with an average particle size of about 300nm 3 (Prosperity Dielectrics Co., BT-2), the addition amount of each component is shown in Table 1.

Embodiment 3

[0072] The preparation procedure is the same as in Example 1, but the dispersant is changed to another lipophilic polymer dispersant KD-1 (Uniqema, Hypermer dispersant C), and the addition amount of each component is shown in Table 1.

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Abstract

The invention relates to a curable cross-linked type ink composition and a dielectric film. The curable cross-linked type ink composition comprises approximate 1 to 10 weight portions of cross-linked curable epoxide resin system, approximate 1 to 30 weight portions of ferroelectric ceramic powder body, approximate 0.1 to 10 weight portions of macromolecular dispersant, and approximate 50 to 96 weight portions of solvent. The ink composition is suitable to manufacture super-dielectric films applied to embedded type capacitors in an ink jet mode.

Description

technical field [0001] The present invention relates to ink compositions, and in particular to a hardenable cross-linked high dielectric ink composition. Background technique [0002] Recently, the demand for daily life and high functionality of electronic products has greatly increased, which relatively makes the printed circuit substrate industry flourish. The ratio of the number of passive components to active components on the substrate has also increased significantly. In order to improve the application of passive components on printed circuit substrates, thinning passive components can greatly reduce the area of ​​circuit boards, and by taking advantage of the advantages of miniaturization technology, thinning It has become a development trend to embed advanced passive components into circuit boards to increase component density. [0003] As far as the embedded capacitor (Embedded capacitor) is concerned, the process is to use the inner layer board process of the mul...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/10H01G4/18H05K1/16C09D11/30
Inventor 洪金贤刘淑芬陈孟晖陈碧义洪铭聪余曼君
Owner IND TECH RES INST
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