Pre-packaged LED illuminating lamp and manufacture method thereof

Abstract

The invention provides a pre-packaged LED illuminating lamp which comprises independent LED lamps 8, a prefabricated film layer 7 of fluorescent powder and binding agent, a lampshade 9 and a transmission mirror 6, wherein at least one independent LED lamp is fixed in the lampshade; the transmission face of the lampshade is provided with the transmission mirror, and the prefabricated thin layer of fluorescent powder and binding agent is bonded inside the transmission mirror; and the independent LED lamps 8 do not contain the fluorescent powder. The LED illuminating lamp manufactured by the packaged structure has high consistency and uniformity of different transmission performances, simplifies the production technique and enhances the production efficiency simultaneously. The packaged structure can be widely applied to the production of various LED illuminating lamps.

Description

technical field [0001] The invention relates to a prepackaged LED lighting lamp and a preparation method thereof, belonging to the field of solid lighting. Background technique [0002] As a new type of solid light source, LED (Light Emitting Diode) develops rapidly because of its small size, fast response, good shock resistance, long life, especially energy saving and environmental protection. In recent years, it has been widely used in large-screen display, traffic signal lights, landscape lighting, street lighting and other fields. [0003] Due to technological development, the current mainstream LED manufacturing method is blue light chip + yellow phosphor powder. The specific process is: first fix the chip on the bracket, connect the circuit; then weigh the phosphor powder and binder according to a certain proportion, Mix the two together and put them in a vacuum desiccator to expel air bubbles (it takes at least 30 minutes), then apply the mixture of phosphor powder a...

AI Technical Summary

Problems solved by technology

[0004] However, in the above-mentioned LED packaging process, there are several key problems: first, it is difficult to keep the concentration of the phosphor powder consistent from beginning to end when dispensing glue, because the phosphor powder maintains a certain particle size in the binder, and the fluorescent powder The powder has a certain weight, and its density is much larger than that of the binder. Therefore, although the binder is relatively viscous, the phosphor will still slowly settle in it, and the time for degassing is longer, which indirectly promotes the phosphor powder. Therefore, when dispensing glue, the concentration of phosphor powder in the glue dispensed at the beginning is higher, and the concentration is lower as the glue is dispensed, which leads to different batches or even LEDs manufactured in the same batch. In the end, the factory must classify the manufactured LEDs according to parameters such as color error or color temperature; second, it is difficult to achieve consistent thickness of the glue on a single chip, because the glue dispensed by the glue dispenser is equal to each other. It is approximately spherical, so the cured phosphor coating must be thick in the middle and thin in the periphery. The light chromaticity of the finally packaged LED must be inconsistent from the middle and the periphery, yellowish in the middle and blue in the periphery; The problem of luminous attenuation caused by the current LED packaging process is to directly dispense the mixture of phosphor and binder onto the chip, and the chip will emit a lot of heat when it is working, causing the temperature around the chip to rise rapidly. As a result, the luminous efficiency of the phosphor is continuously reduced due to heat, which directly affects the life of the LED.

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