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Method for manufacturing probe

A probe and substrate technology, applied in the field of probe manufacturing process, can solve the problems of wafer, wafer, die testing, difficulty in maintaining the hardness of the needle tip, and difficulty in meeting the needs of the industry in size, etc.

Active Publication Date: 2009-09-09
YAU YUN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the size of the probes produced by the existing technology is difficult to meet the needs of the industry, and on the other hand, it is also difficult to maintain the hardness of the needle tip, which has become a dilemma for testing wafers, wafers, and dies.

Method used

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  • Method for manufacturing probe
  • Method for manufacturing probe

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Embodiment Construction

[0021] Below with regard to each step of a kind of method for making probe of the present invention and the effect that can produce, cooperate accompanying drawing to describe in detail as follows with preferred embodiment:

[0022] See first figure 2 As shown, a method for making a probe of the present invention includes the following steps: firstly, take a metal wire and straighten it and then cut it in sequence, degrease, neutralize, wash with water, and then use it as the base material of the present invention Then take a base material 21 and carry out preliminary etching 22, and after the preliminary etching 22, the base material is subjected to neutralization and drying 23 processing; next, the probe is carried out micro-shaping repair 24 with a micro-machine; then micro-etching 25 is processed Afterwards, the base material is cleaned 26 by ultrasonic waves, and the base material is subjected to electroless gold plating 27 , followed by vacuum sputtering 28 , followed b...

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Abstract

The invention discloses a method for manufacturing a probe and mainly relates to a method for manufacturing a probe. The main manufacturing process mainly comprises the following steps: firstly, taking a metal wire as a substrate material and initially etching the substrate material to make the substrate material in an early tip form; secondly, carrying out neutralization and drying; thirdly, carrying out micro-finishing and micro-etching of the substrate material, and cleaning the substrate material; and fourthly, performing chemical plating, vacuum splattering, electrolytic coating hardening; and finally, performing hardening after coloring and thus obtaining a finished product. The probe manufactured by the method is used for detecting crystal plates, wafers and crystal grains. The method allows the probe to have a tip with smaller diameter and inclination angle and strengthens the hardness of the tip.

Description

technical field [0001] The invention relates to a manufacturing process of a probe, in particular to a method for manufacturing a probe including processes such as preliminary etching, micro-repair, micro-etching, gold plating, and hardening of an electrolytic film. Background technique [0002] In the high-tech industry, the objects produced by various production lines need to go through quality control to ensure the pass rate of the final product; especially factories that produce wafers, wafers, and dies have stricter requirements on the pass rate of products. The general method of testing wafers, wafers, and dies is to conduct spot testing with a probe. When spot testing, the needle of the probe is first used to touch the object under test. However, when the probe touches the object under test, it is inevitable that a little error resulting in needle breakage. Since wafers, wafers, and grains are all high-precision technology products, the size of the probes used in the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R3/00G01R1/067
Inventor 呙升华林东尧
Owner YAU YUN TECH CO LTD