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Marginal ring mechanism used in semiconductor manufacture technology

A manufacturing process and edge ring technology, used in semiconductor/solid-state device manufacturing, plasma, electrical components, etc., can solve problems such as high practicability, achieve simple processing, improve particle pollution problems, and facilitate installation and maintenance.

Active Publication Date: 2010-11-03
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0013] The technical problem to be solved by the present invention is to overcome the above-mentioned defects in the prior art and provide an edge ring mechanism used in the semiconductor manufacturing process. Control the temperature uniformity of the edge ring during the process, and the structure is simple and implementable

Method used

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  • Marginal ring mechanism used in semiconductor manufacture technology
  • Marginal ring mechanism used in semiconductor manufacture technology
  • Marginal ring mechanism used in semiconductor manufacture technology

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Embodiment Construction

[0034] see Figure 4a ~ Figure 6b , which shows a preferred embodiment of an edge ring mechanism used in a semiconductor manufacturing process of the present invention, including an electrostatic chuck 41 for fixing a wafer 1, and a lower electrode base 42 is provided below the electrostatic chuck 41, and in said An edge ring 2 is arranged around the electrostatic chuck 41, and a gap 24 is provided between the edge ring 2 and the electrostatic chuck 41. The gap 24 can be used to prevent the thermal expansion coefficient between the edge ring 2 and the wafer 1. The damage that may be caused by the difference can also be used as a section of gas circulation channel, which is preferably a temperature-regulated gas circulation channel; a gas channel 21 is opened on the lower electrode base 42, and a gas channel 21 is opened on the edge ring 2 A gas circulation channel connecting the gap 24 and the gas channel 21 is provided on the top, preferably a temperature-adjusting gas circul...

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Abstract

The invention relates to a marginal ring mechanism used in a semiconductor manufacture technology, comprising an electrostatic chuck for fixing a wafer. A lower electrode base is arranged below the electrostatic chuck, a marginal ring is arranged around the electrostatic chuck, and a gap is formed between the marginal ring and the electrostatic chuck; the lower electrode base is provided with a gas passage, and the marginal ring is provided with a gas communication passage communicated with the gap and the gas passage. The invention can effectively solve the particle pollution problem of the wafer back, can effectively control the temperature of the marginal ring in the technological process and is easy to process and convenient to mount and maintain.

Description

technical field [0001] The invention relates to an edge ring mechanism, in particular to an edge ring mechanism used in a semiconductor manufacturing process. Background technique [0002] For semiconductor manufacturing, the etching step together with the photolithography step determines the final critical dimension of the semiconductor. There are many types of etching devices. According to different principles, they mainly include reactive ion etching (RIE), magnetic field enhanced reactive ion etching (MERIE), inductively coupled plasma etching (ICP), electron cyclotron resonance electric Plasma etching reactors such as plasma etching machines (ECR). figure 1 As shown in a parallel plate plasma etching device, the gas enters the reaction chamber 102 through the gas distribution device through the gas inlet 101. These gases are stable at normal temperature, but under the action of the high-frequency electric field generated by the radio frequency power supply 103, they A...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/683H01L21/3065H01L21/02H01J37/32H05H1/46H01L21/00H05H1/00C23F4/00
Inventor 徐亚伟
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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