Heat radiation structure of surface mounting high-power element
A technology of high-power components and heat dissipation structure, applied in the direction of electrical components, electric solid-state devices, semiconductor devices, etc., can solve problems such as limitations, low thermal conductivity, and no rapid export of high heat, so as to reduce operating temperature and meet The effect of technical requirements
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Embodiment 1
[0018] Embodiment 1: see figure 2 , a heat dissipation structure of a chip-type high-power component, which is used to conduct the heat emitted by the high-power component, including: a circuit board, the heat dissipation surface of the high-power component 1 is directly welded on the circuit board 3 embedded with a heat-conducting copper block 7 Front side; the heat conduction copper block 7 is embedded in the circuit board 3 and has the same thickness as the circuit board 3. The heat conduction copper block 7 has excellent thermal conductivity; one side of the heat dissipation plate 5 is welded with the heat conduction copper block 7, and the other side is connected to the heat dissipation shell 6; the heat dissipation shell 6. Used to transfer heat to the air.
[0019] The present invention is to fix a heat conduction copper block 7 with the same thickness as the circuit board on the position where heat dissipation is required for welding the patch type high-power componen...
Embodiment 2
[0021] Embodiment 2: as figure 2 As shown, on the basis of Embodiment 1, copper pads 8 are plated on the aluminum-based heat sink 5 , and the aluminum-based heat sink 5 is welded to the reverse side of the heat-conducting copper block 7 through the copper pads 8 .
[0022] The principle of the present invention is: the heat emitted by the SMD high-power component 1 is directly transferred to the aluminum-based heat dissipation plate 5 through the heat-conducting copper block 7 embedded in the circuit board 3, and then transmitted to the entire circuit through the heat-dissipating body aluminum substrate 5 On the heat sink 6, the SMD high-power component 1 is directly connected to the heat-conducting copper block 7 embedded in the circuit board 3 by welding, and the heat-conducting copper block 7 and the aluminum-based heat sink 5 are welded together by copper pads 8. One, because the heat dissipation area of the aluminum-based heat sink 5 is much larger than that of the SMD...
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