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Heat radiation structure of surface mounting high-power element

A technology of high-power components and heat dissipation structure, applied in the direction of electrical components, electric solid-state devices, semiconductor devices, etc., can solve problems such as limitations, low thermal conductivity, and no rapid export of high heat, so as to reduce operating temperature and meet The effect of technical requirements

Inactive Publication Date: 2011-09-07
重庆三祥汽车电控系统有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Generally, the heat dissipation method using SMD high-power components is installed in this way, see figure 1 : Design and process a lot of metallized through-holes 2 on the position where the circuit board 3 is welded to the SMD high-power component 1 that needs heat dissipation. When soldering, these metallized through-holes are filled with solder, and the external heat dissipation is installed. When the board 5 is installed, a layer of thermally conductive insulating material 4 should be added between the circuit board 3 and the heat sink 5 to ensure the insulation between the circuit board and the heat sink. 3 and the cooling plate 5 are clamped with screws, or other methods are used to compress the circuit board 3 and the cooling plate 5 to achieve heat dissipation, but the heat conduction area of ​​these metallized through holes is much smaller than the heat dissipation area that can be soldered by the high-power components themselves. It does not have the ability to instantly extract the high heat generated inside the high-power components, because the cross-sectional area of ​​the metallized holes 2 densely distributed on the circuit board is small and the heat conduction insulation between the reverse side of the circuit board and the heat sink is added. The thermal conductivity of material 4 is not very high, so the heat dissipation structure of directly soldering high-power patch components on the circuit board is limited in practical applications

Method used

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  • Heat radiation structure of surface mounting high-power element
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  • Heat radiation structure of surface mounting high-power element

Examples

Experimental program
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Effect test

Embodiment 1

[0018] Embodiment 1: see figure 2 , a heat dissipation structure of a chip-type high-power component, which is used to conduct the heat emitted by the high-power component, including: a circuit board, the heat dissipation surface of the high-power component 1 is directly welded on the circuit board 3 embedded with a heat-conducting copper block 7 Front side; the heat conduction copper block 7 is embedded in the circuit board 3 and has the same thickness as the circuit board 3. The heat conduction copper block 7 has excellent thermal conductivity; one side of the heat dissipation plate 5 is welded with the heat conduction copper block 7, and the other side is connected to the heat dissipation shell 6; the heat dissipation shell 6. Used to transfer heat to the air.

[0019] The present invention is to fix a heat conduction copper block 7 with the same thickness as the circuit board on the position where heat dissipation is required for welding the patch type high-power componen...

Embodiment 2

[0021] Embodiment 2: as figure 2 As shown, on the basis of Embodiment 1, copper pads 8 are plated on the aluminum-based heat sink 5 , and the aluminum-based heat sink 5 is welded to the reverse side of the heat-conducting copper block 7 through the copper pads 8 .

[0022] The principle of the present invention is: the heat emitted by the SMD high-power component 1 is directly transferred to the aluminum-based heat dissipation plate 5 through the heat-conducting copper block 7 embedded in the circuit board 3, and then transmitted to the entire circuit through the heat-dissipating body aluminum substrate 5 On the heat sink 6, the SMD high-power component 1 is directly connected to the heat-conducting copper block 7 embedded in the circuit board 3 by welding, and the heat-conducting copper block 7 and the aluminum-based heat sink 5 are welded together by copper pads 8. One, because the heat dissipation area of ​​the aluminum-based heat sink 5 is much larger than that of the SMD...

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Abstract

The invention provides a heat radiation structure of a surface mounting high-power element for conducting heat energy radiated by the high-power element, comprising a heat-conducting copper block, an aluminum base heat radiation panel, a heat radiation shell. The heat-conducting copper block is embedded in a circuit board and has thickness the same as that of the circuit board; the aluminum base heat radiation panel is plated with a copper welding pan at one surface, while the other surface thereof is connected with the heat radiation shell; and the heat radiation shell radiates heat energy toair in a way of natural convection. The high-power element is enveloped in a way of surface mounting. The installation of the high-power element is characterized in that the high-power element is connected with the front surface of the heat-conducting copper block embedded on the circuit board by welding. The installation of the aluminum base heat radiation panel is characterized in that the aluminum base heat radiation panel is connected with the reverse surface of the heat-conducting copper block embedded on the circuit board by welding. The invention adopts a following heat radiation access: the high-power element-the heat-conducting copper block-the aluminum base heat radiation panel-the air, effectively reduces the work temperature of the high-power element, remains the work temperature of the high-power element at a rated range, and meets the technical requirement of on-vehicle electronic equipment. The heat radiation structure has the advantages of good heat radiation effect, simple structure, low cost, and the like.

Description

technical field [0001] The invention relates to a heat dissipation structure for installing patch type high-power components on a circuit board, in particular to a heat dissipation device for patch type high-power components. Background technique [0002] With the continuous development of automotive electronic products, the motor control unit with high power, miniaturization and light weight is the development direction. Since many existing motor drive chips drive the motor through current amplification by high-power transistors, and the heat sink area and capacity of a single high-power transistor chip are limited, it must be supplemented by a heat dissipation structure to eliminate excessive heat on the chip and quickly The heat is discharged to prolong the service life of high-power transistor chips. Therefore, in mass-produced automotive electronic control products, more high-power transistor products use the SMD packaging form, and how to solder the high-power compone...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/40H01L23/373H01L23/14
CPCH01L2924/0002
Inventor 朱文王瑜
Owner 重庆三祥汽车电控系统有限公司
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